Optoelectronic Semiconductor Component with Integrated Reflector Lens
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Solution Overview
Problem
Conventional optoelectronic semiconductor components are prone to failure due to susceptibility to external forces and require multiple assembly steps, leading to instability and increased costs.
Innovation Solution
A compact optoelectronic semiconductor component design featuring a reflector with a recessed lens configuration and partial adhesive filling, forming a quasi-monolithic optical element that reduces external force susceptibility and simplifies assembly by integrating multiple emitters and detectors with shared optics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional optoelectronic semiconductor components are assembled with separate lenses and reflectors, then assembly flexibility is maintained, but mechanical stability deteriorates due to susceptibility to external forces
Solution Approach 1:
The patent merges the lens and reflector into a single integrated optical component where the lens is directly coupled to the reflector surface. This integration eliminates separate assembly steps for mounting the lens to the reflector, reducing assembly complexity while simultaneously improving mechanical stability by creating a unified structure less susceptible to external forces.
Solution Approach 2:
The integrated optical component serves multiple functions simultaneously: the reflector provides light reflection and directional control, while the lens provides beam shaping and focusing. This multi-functionality in a single component reduces the number of separate parts needed, simplifying assembly while maintaining mechanical integrity.
2Adaptability or versatility
If multiple separate components are used in the optoelectronic assembly, then functional versatility is improved, but assembly steps increase leading to higher costs
Solution Approach 1:
The patent combines multiple optical functions (reflection, beam shaping, focusing) into a single integrated component, reducing the number of separate parts that need to be assembled. This merging maintains functional versatility while significantly reducing assembly steps and associated costs.
Solution Approach 2:
The integrated optical component can be designed with segmented or zoned surfaces that perform different optical functions in different regions. This allows functional versatility to be maintained through surface segmentation rather than requiring multiple separate physical components, thereby simplifying assembly.
3Reliability
If the lens is mounted externally on the reflector, then alignment adjustability is maintained, but susceptibility to external forces increases
Solution Approach 1:
The lens is integrated directly with the reflector surface, creating a unified structure that eliminates the mechanical interface between separate lens and reflector components. This integration dramatically improves resistance to external forces by removing the mounting interface that would be susceptible to detachment, while alignment is established during the integration process itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances mechanical stability, reduces assembly complexity, and achieves cost savings while enabling compact, directional radiation emission and detection, suitable for applications like iris scanning and proximity sensing.
Implementation Method 1
The reflector is adapted to reflect radiation which is emitted by the semiconductor chip
Implementation Method 2
The at least one lens is located partially or fully in the reflector recess
Data Source
AI summary
An optoelectronic semiconductor component may include at least one optoelectronic semiconductor chip, a reflector, a lens, and a connecting layer. The reflector may have a reflector recess where the semiconductor chip may be arranged. The lens may be fully located in the reflector recess, and the lens may have a lens recess. The connecting layer may fasten the lens on the reflector. The lens may have a lens outer side facing toward a reflector inner wall of the reflector recess. A gap may be between the reflector and the lens, and the gap may be filled only partially with the connecting layer. The semiconductor chip may not touch the lens. The optoelectronic semiconductor component may be incorporated into a biometric sensor.