Optoelectronic Semiconductor Component Reflective Layer Design

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing optoelectronic semiconductor components face challenges in achieving a compact and cost-effective design with efficient light reflection and electrical conductivity, as well as preventing light absorption and electrical short circuits.

Innovation Solution

An optoelectronic semiconductor component is developed with an electrically insulating mold body embedding an optoelectronic semiconductor chip, featuring a reflective layer covering at least 50% of the top side for both electrical conductivity and light reflection, and a dielectric layer for insulation between the reflective layer and potential-carrying regions to prevent short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a reflective layer is added to the top side of the mold body to prevent light absorption, then the usable luminous power increases, but the device complexity and manufacturing cost increase

Engineering Contradiction:

Improvelight absorption in mold bodyVSAvoidstructure complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies the multi-functionality principle by making the reflective layer serve dual purposes: it provides electrical connection between the semiconductor chip contact and the through contact, and simultaneously prevents light absorption by reflecting light away from the mold body. This eliminates the need for separate electrical connection elements and light management structures, thereby reducing overall device complexity while achieving both electrical conductivity and optical performance.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the electrical connection function and the light reflection function into a single reflective layer structure. By combining these two previously separate functions into one component, the patent reduces the number of parts, simplifies the structure, and lowers manufacturing complexity while achieving both electrical conductivity and light management objectives.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If bonding wires are used to form electrical connections, then the manufacturing process is simple, but the component robustness decreases

Engineering Contradiction:

Improveelectrical connection manufacturingVSAvoidcomponent robustness

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces the mechanical bonding wire system with a reflective layer-based electrical connection system. Instead of using fragile wire bonds that require precise positioning and are susceptible to mechanical stress, the patent uses a continuous reflective layer that provides inherent mechanical strength and electrical conductivity simultaneously, thereby improving robustness while maintaining manufacturing simplicity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Loss of energy

If the reflective layer covers the entire top side of the mold body, then light reflection is maximized, but light coupling out from the semiconductor chip is impeded

Engineering Contradiction:

Improvelight reflection efficiencyVSAvoidlight coupling out efficiency

Core Design Contradiction:

Loss of energyVSUse of energy by moving object

Solution Approach 1:

The patent applies the local quality principle by making the reflective layer selectively cover only certain regions of the mold body top side. Specifically, the reflective layer is positioned to cover areas where light reflection is beneficial (away from the chip emission area) while leaving the region above the semiconductor chip's radiation emission surface uncovered. This localized approach ensures that light can couple out efficiently from the chip while still achieving effective light reflection and management in other areas.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a compact, cost-effective, and robust optoelectronic semiconductor component with enhanced light reflectivity and electrical insulation, increasing usable luminous power and preventing electrical breakdowns.

Implementation Method 1

a reflective layer is arranged on the top side of the mold body... the reflective top side of the mold body of the semiconductor component prevents absorption of light in the material of the mold body

Methodology Applied

Scientific EffectLight reflection: Reflection

Implementation Method 2

in the region of the electrically conductive connection between the electrical contact of the semiconductor chip and the through contact a dielectric is arranged between the top side of the mold body and the reflective layer

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS9209368B2Optoelectronic semi-conductor component

Publication Date: 2015.12.08 OSRAM OLED

AI summary

An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.