Optoelectronic Sensor Module with Opaque Potting Body
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Solution Overview
Problem
Existing optoelectronic sensor modules face challenges in miniaturization and optical crosstalk, which hinder their ability to efficiently determine pulse frequency and oxygen saturation in blood while maintaining a compact and space-saving design.
Innovation Solution
The optoelectronic sensor module incorporates semiconductor transmitter chips emitting different wavelengths, a radiation-opaque potting body, and integrated optics to minimize space and prevent optical crosstalk, allowing for a compact, self-supporting arrangement that rests directly on a body part for signal transfer without free beam paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor transmitter chips emitting different wavelengths are integrated into a compact sensor module, then the functionality for determining pulse frequency and oxygen saturation is improved, but optical crosstalk between chips increases
Solution Approach 1:
The sensor module integrates multiple semiconductor transmitter chips (first wavelength, second wavelength, and optionally third wavelength) and detector chips as separate functional segments within a common potting body. Each chip is spatially separated and individually positioned, allowing independent optimization of each wavelength channel while maintaining compact overall dimensions. This segmentation enables multi-functional capability without excessive optical interference between components.
Solution Approach 2:
The patent employs optical elements (lenses, light guides, or reflectors) positioned between the transmitter chips and detector chips to control and direct light paths. These intermediary optical components ensure that radiation from each wavelength-specific transmitter chip is directed to the appropriate detector region, preventing direct optical crosstalk while maintaining efficient signal transfer for pulse frequency and oxygen saturation measurements.
2Volume of moving object
If the sensor module is miniaturized to reduce space requirements, then the compactness is improved, but the distance between chips increases optical crosstalk
Solution Approach 1:
The patent embeds multiple chips and optical elements within a single potting body that encapsulates the entire sensor module. The transmitter chips, detector chips, and optical elements are nested within this common housing, with each component positioned in a specific region. This nested arrangement achieves miniaturization by consolidating all functional elements into a compact volume while maintaining sufficient spatial separation through careful internal layout to prevent optical crosstalk.
Solution Approach 2:
The patent utilizes three-dimensional positioning of chips within the potting body, arranging transmitter and detector chips at different depths and lateral positions. By exploiting the third dimension (vertical depth within the potting body) in addition to lateral spacing, the design achieves compact footprint while maintaining adequate optical isolation distances, effectively reducing crosstalk without increasing overall module volume.
3Area of stationary object
If chips are arranged close to each other in a common plane, then the space efficiency is improved, but mechanical stability and optical isolation become more difficult to maintain
Solution Approach 1:
The patent combines multiple chips (transmitter chips for different wavelengths and detector chips) into a single mechanically integrated assembly within the potting body. All chips are mounted on a common substrate or directly embedded in the potting material, creating a unified mechanically stable structure. This merging approach maintains compact two-dimensional arrangement while the potting body provides overall mechanical reinforcement and stress distribution across all chips.
Solution Approach 2:
The patent uses a potting body made of composite material (epoxy resin with additives such as silica, aluminum oxide, or other fillers) that provides both mechanical stability and optical properties. The composite material reinforces the chip assembly mechanically while maintaining optical transparency or desired optical characteristics, enabling close chip spacing without compromising structural integrity or optical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a miniaturized, space-saving sensor module with reduced optical crosstalk, facilitating accurate pulse frequency and oxygen saturation measurements, suitable for applications like pulse oximetry.
Implementation Method 1
one or more first semiconductor transmitter chips (21) which are designed to emit radiation of a first wavelength, in particular in the near-infrared spectral range, for instance around 940 nm
Implementation Method 2
one or more semiconductor detector chips (3) which are designed to detect the radiation of the first, second and optionally the third wavelength
Implementation Method 3
The potting body is preferably opaque to the radiation emitted by the semiconductor transmitter chips
Data Source
AI summary
An optoelectronic sensor module and a method for producing an optoelectronic sensor module are disclosed. In an embodiment an optoelectronic sensor module includes a first semiconductor transmitter chip configured to emit radiation of a first wavelength, a second semiconductor transmitter chip configured to emit radiation of a second wavelength different from the first wavelength, a semiconductor detector chip configured to detect the radiation of the first and second wavelengths, and a first potting body being opaque to the radiation of the first and the second wavelength, wherein the first potting body directly covers side surfaces of the chips and mechanically connects the chips located in a common plane to one another, wherein a distance between the chips is less than or equal to twice an average diagonal length of the chips, and wherein the sensor module is adapted to rest against a body part to be examined.