Optoelectronic Component With Side Contacts
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Solution Overview
Problem
Optoelectronic components with light emitting semiconductor chips face challenges in electrical contacting due to limited space on the component rear side, leading to restricted soldering surface positions and potential short circuits during mounting.
Innovation Solution
An optoelectronic component design where a light emitting semiconductor chip is embedded in an insulating layer with electrically conductive contact layers on opposite side faces, allowing for lateral electrical contacting and increased mechanical stability, and a method involving embedding the chip in an insulating layer, applying conductive contact layers, and covering them with a second insulating layer to create soldering surfaces not limited by chip geometry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering surfaces are implemented on the component rear side, then electrical contacting of rear contacts is achieved, but the position and arrangement is limited by chip geometry and space is very restricted
Solution Approach 1:
The patent transitions the soldering surfaces from the two-dimensional rear side of the component to the lateral side faces. By leading out the electrically conductive contact layers laterally through the insulating material to the side faces, the invention utilizes a different spatial dimension for mounting, thereby avoiding the space constraints on the rear side while maintaining reliable electrical contacting.
2Reliability
If soldering surfaces are implemented on the component rear side, then electrical contacting is achieved, but short circuits during mounting may occur
Solution Approach 1:
The insulating material serves as an intermediary that physically separates and electrically isolates the electrically conductive contact layers leading to different rear contacts. By routing these contact layers laterally through the insulating material to opposite side faces, the invention prevents potential short circuits that could occur if multiple soldering surfaces were crowded on the rear side, while still achieving reliable electrical contacting.
3Adaptability or versatility
If electrically conductive contact layers are led laterally from the component, then soldering surfaces not limited by chip geometry are provided, but device complexity increases
Solution Approach 1:
The invention merges the functions of electrical contacting and mechanical stabilization into the same laterally led electrically conductive contact layers. These contact layers not only provide electrical connection to the rear contacts but also serve as mechanical anchors that stabilize the semiconductor chip within the insulating material, thereby reducing overall device complexity despite the lateral routing.
Solution Approach 2:
The electrically conductive contact layers perform multiple functions: they provide electrical connection to the rear contacts, serve as soldering surfaces for mounting, and act as mechanical stabilizers for the chip. This multi-functionality reduces the need for separate structural elements, offsetting the increased complexity from lateral routing with functional consolidation.
Data Source
AI summary
An optoelectronic component includes a light emitting semiconductor chip, including an emission side and comprising an underside, wherein the optoelectronic component is configured to emit light via the emission side, the optoelectronic component including an insulating layer, the light emitting semiconductor chip is embedded into the insulating layer, the light emitting semiconductor chip including two electrical contact locations, the contact locations face away from the emission side, a first and a second electrically conductive contact layer are provided, respectively, an electrically conductive contact layer electrically conductively connects to a contact location of the semiconductor chip, the electrically conductive contact layers are arranged in the insulating layer, the first electrically conductive contact layer adjoins a first side face of the optoelectronic component, and the second electrically conductive contact layer adjoins a second side face of the optoelectronic component.