Optoelectronic Device Substrate Cleaving via Energy Injection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting diodes (LEDs) suffer from reduced light extraction efficiency due to total internal reflection (TIR) caused by the flat surface of the transparent substrate and the mismatch in refractive indices between the substrate and the external environment.
Innovation Solution
A method of fabricating an optoelectronic device involves forming a light emitting stack on a substrate with modified regions created by energy injection, including extension sections, to facilitate cleaving and enhance light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat transparent substrate is used in conventional LEDs, then the device structure is simple and easy to manufacture, but total internal reflection occurs due to refractive index mismatch, drastically reducing light extraction efficiency
Solution Approach 1:
The patent applies curvature by forming convex and concave patterns on the substrate surface. The convex patterns protrude upward while concave patterns凹陷 downward, creating non-planar optical interfaces that reduce total internal reflection and improve light extraction efficiency without compromising manufacturing feasibility
Solution Approach 2:
The patent implements local quality by creating distinct convex and concave regions with different optical properties in specific areas of the substrate. These localized structural variations modify light extraction characteristics in targeted zones while maintaining overall substrate integrity and manufacturability
2Loss of energy
If the substrate surface is modified to reduce total internal reflection, then light extraction efficiency improves, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the substrate surface into multiple discrete convex and concave patterns arranged in arrays. This segmentation approach enables systematic light extraction enhancement across the substrate while maintaining regular geometric structures that can be manufactured using standard photolithography and etching processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach effectively increases light extraction efficiency by modifying the substrate structure, reducing TIR and improving the performance of LEDs.
Implementation Method 1
forming a supporting layer covering the light emitting stack
Implementation Method 2
forming a plurality of first modified regions in the substrate by employing a first energy into the substrate
Implementation Method 3
cleaving the substrate
Implementation Method 4
one of the plurality of first modified regions has a first extension section extended from an upper edge of the first modified regions and formed between the first modified region and the second major surface of the substrate
Data Source
AI summary
A method of fabricating an optoelectronic device, comprises: providing a substrate, wherein the substrate comprises a first major surface and a second major surface opposite to the first major surface; forming a light emitting stack on the second major surface of the substrate; forming a supporting layer covering the light emitting stack; forming a plurality of first modified regions in the substrate by employing a first energy into the substrate after forming the supporting layer; and cleaving the substrate.