Sealing Structure for Optoelectronic Transceiver in Immersion Cooling

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Solution Overview

Problem

Existing optoelectronic transceiver devices in immersion cooling systems face challenges with liquid and moisture leakage, which can damage internal components.

Innovation Solution

A sealing structure comprising a first and second casing, with a sealing element including a retaining block and sealing strips, is used to create a hermetic seal around the optoelectronic transceiver device, preventing liquid and air from entering the accommodation space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the optoelectronic transceiver device is used in an immersion cooling system, then heat dissipation performance is improved, but the device is exposed to liquid leakage and permeation damage

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidliquid leakage and permeation damage
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The sealing structure divides the device into separate sealed compartments using multiple casings (first casing, second casing, third casing) that enclose different functional components. Each casing forms an independent sealed space, preventing liquid from reaching internal components while allowing the device to operate in immersion cooling environments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Sealing elements act as intermediary components between the cooling liquid environment and the device internals. These sealing elements (including sealing rings, sealing strips, and adhesive layers) create a protective barrier that mediates the interaction between the external cooling fluid and internal components, preventing harmful permeation while maintaining thermal contact.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If sealing elements are added to prevent liquid leakage, then protection against permeation is improved, but device complexity increases

Engineering Contradiction:
Improveprotection against permeationVSAvoiddevice complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent employs flexible sealing elements including sealing rings, sealing strips, and adhesive layers that form thin-film barriers. These flexible sealing components conform to the device geometry and create effective seals without requiring complex rigid structures, thus providing permeation protection while maintaining relatively simple device architecture.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The sealing structure utilizes composite material systems combining different sealing mechanisms (mechanical sealing rings, adhesive seals, and structural casing materials). This composite approach integrates multiple sealing functions into a unified structure that provides comprehensive protection without proportionally increasing complexity.

Inventive Principle:
Principle #40Composite materials

3Reliability

If multiple casings and sealing elements are used, then sealing effectiveness is improved, but manufacturing difficulty increases

Engineering Contradiction:
Improvesealing effectivenessVSAvoidmanufacturing difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The device is segmented into modular casing units (first casing, second casing, third casing) that can be manufactured separately and then assembled. This segmentation allows each casing to be produced using standard manufacturing processes, and the modular design simplifies quality control and assembly procedures compared to creating a single complex sealed structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Sealing elements serve as intermediary components that simplify the manufacturing process by providing standardized sealing solutions between casing components. These pre-fabricated sealing elements (rings, strips, adhesives) can be independently manufactured and quality-tested, then integrated during assembly, reducing the overall manufacturing complexity while maintaining high sealing effectiveness.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250035867A1Sealing structure for optoelectronic transceiver device
Publication Date: 2025.01.30 AIP INC(CN)
  • US20250035867A1 patent drawing
  • US20250035867A1 patent drawing
  • US20250035867A1 patent drawing

AI summary

A sealing structure for an optoelectronic transceiver device includes a first casing, a second casing, and a sealing element. The optoelectronic transceiver device is arranged between the first casing and the second casing. At least a notch portion is arranged between peripheral portions of the first casing and the second casing. The sealing element includes at least a retaining block positioned in the notch portion and encompassing a part of an optical fiber assembly, which is included in the optoelectronic transceiver device and extends out of the notch portion.