Optoelectronic Device Transfer via Etched Bonding Layer Release
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Solution Overview
Problem
Current methods for transferring optoelectronic devices, such as light-emitting diodes, face challenges in managing transfer steps and are costly due to the need for complex manufacturing processes and sacrificial structures, which are not suitable for temperature-sensitive devices and do not effectively control adhesive forces during substrate removal.
Innovation Solution
A method involving a bonding layer on a handling substrate, where the optoelectronic device is bonded and then partially etched to form a narrow portion, allowing for reduced adhesive force and simplified transfer without the need for additional sacrificial structures, enabling cost-effective and independent management of transfer steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a bonding layer is used to transfer optoelectronic devices, then the devices can be transferred from donor substrate to receiver substrate, but the adhesive force is too strong making it difficult to remove the handling substrate
Solution Approach 1:
The bonding layer is segmented into two distinct regions: a first region with first adhesive properties for bonding the device, and a second region with second adhesive properties for easy removal. This segmentation allows different adhesive strengths in different areas, resolving the contradiction between strong bonding and easy removal.
Solution Approach 2:
Different regions of the bonding layer are given different local qualities (adhesive properties). The first region has high adhesion to secure the device during transfer, while the second region has low adhesion to facilitate easy removal of the handling substrate. This local differentiation resolves the contradiction.
2Reliability
If sacrificial structures are formed during device manufacture, then adhesive force can be controlled during transfer, but the manufacturing process becomes complex and costly
Solution Approach 1:
The bonding layer combines multiple functions into a single structure: it provides adhesive bonding, defines release regions, and eliminates the need for separate sacrificial structures. This merging simplifies the manufacturing process while maintaining reliable adhesive force control.
Solution Approach 2:
The invention extracts the adhesive control function from separate sacrificial structures and integrates it directly into the bonding layer itself. By taking out the need for additional sacrificial layers, the process complexity is reduced while adhesive force control is maintained through the differentiated adhesive properties.
3Adaptability or versatility
If temperature-dependent bonding is used to vary adhesive force, then bonding strength can be adjusted, but this solution is not suitable for temperature-sensitive devices
Solution Approach 1:
Instead of changing temperature to vary adhesive force, the invention changes the chemical or physical parameters of the bonding layer itself by creating regions with different adhesive properties. This allows adhesive force variation without subjecting temperature-sensitive devices to thermal stress.
4Productivity
If the bonding layer is fully removed after transfer, then the handling substrate can be reused, but the devices lose their support during assembly
Solution Approach 1:
The bonding layer is segmented into a first region that maintains device support during assembly and a second region that allows handling substrate removal. This segmentation enables the handling substrate to be reused while devices retain adequate support throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process, reduces costs, and improves the management of transfer steps by forming the narrow portion after bonding, allowing for efficient separation and assembly of optoelectronic devices onto a receiver substrate without pre-manufactured pads, facilitating reuse of handling substrates.
Implementation Method 1
bond the optoelectronic device over the handling substrate via a bonding layer
Implementation Method 2
partially etch the bonding layer so as to preserve a narrow portion of the bonding layer
Data Source
AI summary
A method for transferring a device from a first substrate to a second substrate by way of a manipulation substrate. The method includes bonding the device to the manipulation substrate by way of an assembly layer at a bonding surface, partially etching the assembly layer so as to conserve a narrow portion interposed between the device and the manipulation substrate, the narrow portion having a cross section strictly smaller than the bonding surface, the method being characterized in that the assembly layer is formed beforehand on the manipulation substrate and exclusively on the manipulation substrate.