Optoelectronic Component Transfer for Deep-Cavity Bonding
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Solution Overview
Problem
Existing methods for transferring optoelectronic semiconductor components to printed circuit boards face challenges when the components are in deep cavities or surrounded by protrusions, as applying necessary pressure is difficult due to collisions with surrounding structures, hindering the formation of a reliable electrical and mechanical connection.
Innovation Solution
A method involving a structurable material layer is applied to the semiconductor component, structured to compensate for surface topographies, allowing for the application of pressure through a protruding surface, enabling reliable transfer and connection even in complex geometries, using techniques like thermo-compression bonding and potentially including sacrificial layers for easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large-area rigid plate is used to apply pressure to the optoelectronic semiconductor component, then the electrical and mechanical connection can be established, but the plate collides with surrounding protrusions and cannot apply sufficient pressure to components in deep cavities
Solution Approach 1:
A transfer unit acts as an intermediary between the pressure application system and the optoelectronic semiconductor component. This transfer unit can adapt its shape to conform to the cavity geometry, allowing pressure to be applied effectively to components in deep cavities or surrounded by protrusions, thereby resolving the contradiction between establishing reliable connections and ease of pressure application
Solution Approach 2:
The transfer unit is designed to be deformable or adaptable in shape, allowing it to dynamically conform to different cavity geometries and component positions. This dynamic adaptation enables the system to apply pressure effectively regardless of the component's location or surrounding structures, maintaining both connection reliability and operational ease
2Productivity
If the optoelectronic semiconductor component is placed in a deep cavity or surrounded by protrusions, then integration density is improved, but applying necessary pressure for bonding becomes difficult
Solution Approach 1:
The transfer unit serves as a mediator that bridges the gap between the pressure application mechanism and the component in the cavity. Its ability to conform to the cavity shape ensures that bonding pressure can be applied with the same precision whether the component is in a deep cavity or on a flat surface, thus maintaining manufacturing precision while enabling high integration density
3Reliability
If a structurable material layer is applied and structured to compensate for surface topographies, then pressure can be applied uniformly, but the process complexity increases
Solution Approach 1:
The structurable material layer acts as an intermediary that compensates for surface topography variations. By applying and structuring this material layer, the system achieves uniform pressure distribution and reliable connections without requiring complex adaptive pressure application mechanisms, thus managing process complexity while maintaining connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a reliable, simple, and cost-effective method for establishing mechanical and electrical connections by compensating for height differences and preventing damage during the transfer process, allowing for improved light guidance and reduced crosstalk.
Implementation Method 1
Thermocompression bonding is a common approach for electrically and mechanically bonding an optoelectronic semiconductor component to, for example, a printed circuit board. In this process, for example, a force is applied to a top surface of the optoelectronic semiconductor component opposite the printed circuit board by means of a mostly rigid plate, thereby pressing the optoelectronic semiconductor component onto the printed circuit board. Optionally, the optoelectronic semiconductor component can be heated via the plate
Data Source
AI summary
In embodiments a method includes providing an optoelectronic semiconductor component on the first carrier, applying a structurable material layer on the at least one optoelectronic semiconductor component, structuring the at least one structurable material layer in such a way that a partial region of the structured material layer on a top surface of the optoelectronic semiconductor component is assigned to the optoelectronic semiconductor component; picking up the optoelectronic semiconductor component by a transfer unit, lifting the optoelectronic semiconductor component off the first carrier, arranging the optoelectronic semiconductor component on a first region of the second carrier, wherein at least a second region adjacent to the first region on the second carrier protrudes the top surface of the optoelectronic semiconductor component and fixing the optoelectronic semiconductor component to the second carrier.