Optoelectronic device and manufacturing method
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Solution Overview
Problem
Existing methods for transferring optoelectronic devices, such as LEDs, are complex and restrictive due to the need for sacrificial structures, which limits device density and can result in residue issues affecting electrical contact quality.
Innovation Solution
A transfer structure with projecting elements that form a cavity under the optoelectronic device, allowing for easy detachment and increased density, along with a method involving a support structure with projecting elements that facilitate the transfer of devices from a donor substrate to a receiver substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If sacrificial structures are used to wrap each device during manufacture, then devices can be easily attached and detached from the handling substrate, but the manufacturing process becomes complex and restrictive
Solution Approach 1:
The invention extracts the sacrificial structure from the device assembly process entirely. Instead of wrapping each device with sacrificial material, the patent uses a handling substrate with protrusion elements that mechanically engage with recesses in the devices, allowing attachment and detachment without any sacrificial structures.
Solution Approach 2:
The invention introduces a handling substrate as an intermediary between the donor substrate and the devices. This substrate with protrusion elements serves as a temporary holding mechanism that facilitates device transfer without requiring sacrificial structures on the devices themselves.
2Stability of the object's composition
If sacrificial structures are formed around each device, then devices can be stabilized during trimming, but sufficient space must be provided between devices which limits device density
Solution Approach 1:
The invention moves the stabilization function from the horizontal plane (sacrificial structures wrapping devices) to the vertical dimension (protrusion elements extending from the handling substrate upward to engage device recesses). This dimensional change allows devices to be stabilized during trimming without requiring lateral spacing between them.
Solution Approach 2:
The handling substrate is segmented into multiple protrusion elements, each engaging with a corresponding device. This segmentation allows independent stabilization of each device during trimming while maintaining high device density on the donor substrate.
3Ease of operation
If holding pads are used to retain devices on the handling substrate, then detachment is facilitated, but residues may remain on devices affecting electrical contact quality
Solution Approach 1:
The invention inverts the traditional approach by having the handling substrate provide the retention mechanism through protrusion elements that engage with device recesses, rather than having holding pads on the devices. This reversal ensures that no adhesive or bonding material is applied to the device surfaces, eliminating residue contamination and preserving electrical contact quality.
Data Source
AI summary
A transfer structure including a substrate and an optoelectronic device attached to the substrate, the substrate including a base portion having a substrate face, and at least one element projecting from the substrate face, the optoelectronic device having a first face including a central zone and a peripheral zone surrounding the central zone, the transfer structure where the at least one projecting element of the substrate is attached to the peripheral zone of the first face of the optoelectronic device. One or more embodiments also relate to a method for transferring optoelectronic devices, which method is based on the implementation of transfer structures.