Optoelectronic Structure Vertical Waveguide Coupling

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Solution Overview

Problem

Traditional cable transmission experiences signal integrity issues due to high impedance from capacitance and inductance, limiting transmission distance and power loss, while optical communication faces challenges in coupling optical signals from silicon photonics devices to optical components, leading to energy loss and bandwidth limitations.

Innovation Solution

An optoelectronic structure with a non-traditional shallow V-groove or U-groove for passive alignment is used to attach optical fibers, featuring a substrate, electronic die, and photonic die with an exposed optical waveguide for efficient light transfer, minimizing CTE mismatch and structural integrity issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional cable transmission is used, then electrical signal transmission is achieved, but signal integrity deteriorates due to high impedance from capacitance and inductance

Engineering Contradiction:

Improvesignal integrityVSAvoidpower loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent replaces traditional electrical cable transmission with optical fiber transmission. The optical waveguide on the photonic die transmits optical signals instead of electrical signals through traditional cables, eliminating the impedance and signal integrity issues associated with electrical transmission at high speeds.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the transmission medium from electrical conductors to optical waveguides, fundamentally changing the transmission parameter from electrical signals to optical signals. This parameter change eliminates the capacitance and inductance issues that cause signal integrity deterioration in traditional cable transmission.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If edge coupling is used to emit optical signals horizontally from the waveguide, then optical coupling is achieved, but wafer-level optical measurement during manufacturing becomes difficult

Engineering Contradiction:

Improveoptical coupling efficiencyVSAvoidwafer-level measurement capability

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the optical coupling direction from horizontal (edge coupling) to vertical (top-down coupling). The optical waveguide is configured to emit optical signals vertically from the top surface of the photonic die, enabling wafer-level measurement during manufacturing while maintaining effective optical coupling to the optical component.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If grating coupling is used to emit optical signals vertically from the waveguide, then wafer-level optical measurement is enabled, but bandwidth is limited

Engineering Contradiction:

Improvewafer-level measurement capabilityVSAvoidbandwidth

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent extracts the grating structure from the coupling mechanism and replaces it with a direct vertical emission approach. Instead of using grating diffraction for vertical coupling, the optical waveguide is designed to emit optical signals directly vertically from the top surface, eliminating the bandwidth limitations imposed by grating coupling while maintaining wafer-level measurement capability.

Inventive Principle:

Principle #2Taking out (Extraction)

4Device complexity

If the size of silicon photonics device does not match the optical component, then coupling is simplified, but energy loss of signals increases

Engineering Contradiction:

Improvecoupling structure complexityVSAvoidsignal energy loss

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The patent changes the coupling interface parameters by configuring the optical waveguide to emit vertically from the top surface of the photonic die. This parameter change allows for better size matching between the silicon photonics device and the optical component, reducing signal energy loss during coupling while maintaining reasonable coupling structure complexity.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances signal integrity and reduces power loss, enabling higher speed transmission and improved units per hour (UPH) performance, while maintaining structural integrity and reducing energy loss during optical signal coupling.

Implementation Method 1

an optical waveguide exposed from the side surface for transferring lights from or into the optical component

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS11675136B2Optoelectronic structure

Publication Date: 2023.06.13 ADVANCED SEMICON ENG INC

AI summary

An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.