Opto-Electronic Module Wafer Stack Alignment and Stray Light Control
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Solution Overview
Problem
Current methods for manufacturing opto-electronic modules are inefficient and lack precision, leading to potential issues with stray light and cross-talk, and the modules are often not small enough for compact electronic devices.
Innovation Solution
A method involving a substrate wafer with detecting members, a spacer wafer with blocking portions, and an optics wafer with transparent and blocking portions, arranged to restrict undesired light and enhance alignment, using replication and pick-and-place techniques for efficient and precise manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional overmolding techniques are used to manufacture opto-electronic modules, then the manufacturing process is simple, but the manufacturing precision and alignment accuracy are poor
Solution Approach 1:
The patent divides the manufacturing process into separate stages: wafer-level preparation of detecting members and optical elements, followed by precise alignment and bonding of these pre-prepared wafers. This segmentation allows each wafer to be optimized independently for its function while achieving high overall precision through controlled assembly.
Solution Approach 2:
The patent performs preliminary preparation of detecting members and optical elements on separate wafers before final assembly. This includes pre-aligning features, pre-bonding structures, and pre-positioning components on their respective wafers, which enables higher precision during the final module assembly stage.
2Volume of moving object
If module size is reduced for compact electronic devices, then the devices become more compact, but stray light and cross-talk increase
Solution Approach 1:
The patent implements local quality control through patterned blocking portions on the optics wafer that are strategically positioned to block stray light paths while maintaining optical transmission where needed. The detecting members are also locally optimized with selective transparency regions that allow desired light while blocking harmful stray light and cross-talk from adjacent elements.
Solution Approach 2:
The patent introduces intermediary blocking portions and opaque regions as mediators between light sources and detecting members. These intermediary structures selectively intercept and block stray light and cross-talk before they can reach unintended detecting members, while allowing desired optical signals to pass through transparent portions.
3Productivity
If wafer-scale manufacturing is implemented, then productivity increases, but the complexity of ensuring precise alignment increases
Solution Approach 1:
The patent creates equipotential alignment conditions by providing reference alignment features (such as alignment marks or interlocking structures) on both the detecting member wafer and the optics wafer. These features ensure that when the wafers are bonded together, the detecting members automatically align with their corresponding optical elements without requiring complex external alignment equipment.
Solution Approach 2:
The patent merges multiple functions into the wafer structures themselves: alignment features are integrated into the wafer edges or surfaces, blocking portions are combined with optical elements on the same wafer, and electrical connections are pre-established during wafer fabrication. This integration simplifies the overall assembly process while maintaining high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the rapid and accurate production of small, high-precision opto-electronic modules with reduced stray light and cross-talk, enabling their use in compact electronic devices.
Implementation Method 1
an optics wafer, the optics wafer comprising a multitude of transparent portions transparent for light generally detectable by the detecting members and at least one blocking portion for substantially attenuating or blocking incident light generally detectable by the detecting members
Data Source
AI summary
Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.