Opto-electronic Circuit Board In-Plane Waveguide Signal Routing
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Solution Overview
Problem
Conventional opto-electronic circuit boards experience optical signal distortion and energy loss due to the need to change the transmission path of optical signals, which affects alignment precision and efficiency.
Innovation Solution
The design includes a waveguide layer with a core layer clad between bottom and top cladding layers, and emitting and receiving portions with light-guide holes and reflective layers that align with the core layer, allowing optical signals to enter and exit without changing their transmission direction, reducing energy loss and improving alignment precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical signal transmission path is changed vertically through 45-degree incident and outgoing faces, then the optical signal can be guided into and out of the waveguide, but optical signal distortion and energy loss occur
Solution Approach 1:
The patent transitions from vertical 45-degree signal routing to horizontal in-plane signal transmission. The waveguide layer is configured with the optical signal traveling horizontally along the circuit board plane, eliminating the need for vertical incident and outgoing faces. This dimensional change from vertical to horizontal transmission path resolves the energy loss issue while maintaining effective signal guidance.
2Reliability
If the optical signal transmission path is changed vertically through 45-degree incident and outgoing faces, then the optical signal can be guided into and out of the waveguide, but alignment precision deteriorates
Solution Approach 1:
The patent eliminates vertical alignment requirements by transitioning to horizontal in-plane transmission. The emitting and receiving portions are disposed on the same side of the waveguide layer, allowing alignment to be achieved through simple lateral positioning rather than complex vertical angular alignment. This significantly improves alignment precision and manufacturing feasibility.
3Reliability
If the optical signal transmission path is changed vertically through 45-degree incident and outgoing faces, then the optical signal can be guided into and out of the waveguide, but the transmission path becomes longer and more complex
Solution Approach 1:
The patent simplifies the transmission path by configuring the waveguide layer to guide optical signals horizontally along the circuit board plane. The emitting portion and receiving portion are disposed on the same side, creating a direct in-plane transmission path that eliminates complex vertical routing, 45-degree reflection faces, and multiple transmission path segments. This reduces both physical path length and structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces optical signal energy loss and enhances transmission accuracy by maintaining the signal path, improving the overall efficiency of signal transmission in opto-electronic circuit boards.
Implementation Method 1
a core layer which is clad between the bottom cladding layer and the top cladding layer
Data Source
AI summary
An opto-electronic circuit board includes a substrate, a cavity, blind vias, metal layers, a first chip, a second chip, and the optical component. The substrate includes a first circuit layer, a second circuit layer, and a dielectric layer disposed between the first circuit layer and the second circuit layer. The cavity is disposed on the dielectric layer, in which the cavity extends from the first circuit layer to the second circuit layer. The blind vias are disposed at opposite sides of the cavity. The first chip is disposed on the second circuit layer with corresponding to one of the blind vias. The second chip is disposed on the second circuit layer with corresponding to the other one of the blind vias. The optical component is disposed in the cavity, in which the second surface of the optical component is connected to the first circuit layer.