Optoelectronics Transceiver Encapsulation for Liquid Cooling

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Solution Overview

Problem

Optoelectronics transceiver devices in optical fiber network devices are prone to cooling liquid seepage when immersed in high thermal conductivity liquids, affecting signal transmission and device performance.

Innovation Solution

An optoelectronics transceiver device with an encapsulation film and adhesive to create a sealed operating environment, preventing cooling liquid ingress and enhancing waterproof performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the optoelectronics transceiver device is immersed in cooling liquid to achieve effective heat dissipation, then the heat dissipation performance is improved, but the waterproof performance deteriorates causing cooling liquid to seep into the device

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidwaterproof performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The device is divided into separate functional zones: a sealed processing space containing the optoelectronics transceiver module and a cooling space for heat dissipation. The sealing structure creates distinct boundaries that prevent cooling liquid from reaching the electronic components while allowing the device to operate in a liquid-cooled environment.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A sealing structure acts as an intermediary barrier between the cooling liquid and the optoelectronics transceiver module. This sealing layer selectively isolates the electronic components from the cooling environment, preventing liquid ingress while maintaining thermal management effectiveness through alternative heat dissipation pathways.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the optoelectronics transceiver module is directly exposed to the cooling liquid, then the heat dissipation efficiency is improved, but the risk of cooling liquid seepage and damage to the device increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcooling liquid seepage damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The sealing structure utilizes flexible sealing materials and thin film barriers to create a protective enclosure around the optoelectronics transceiver module. These flexible sealing elements conform to the module geometry while maintaining an impermeable barrier that prevents cooling liquid penetration despite the module's exposure to the cooling environment.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If a sealing structure is added to prevent cooling liquid ingress, then the waterproof performance is improved, but the device complexity increases

Engineering Contradiction:

Improvewaterproof performanceVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sealing structure is integrated with existing device components such as the housing and mounting structures. By combining the sealing function with structural elements already present in the device, the solution avoids adding separate, independent sealing systems, thereby minimizing the increase in overall device complexity while achieving reliable waterproof performance.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents cooling liquid from seeping into the device, improving operational efficiency and extending the service life of the optoelectronics transceiver device.

Implementation Method 1

an adhesive, which is filled into the base internal space to form a sealing subspace within the base internal space

Methodology Applied

Scientific EffectAdhesive: Adhesive

Implementation Method 2

an encapsulation film, which covers the optoelectronics transceiver module processing section within the base internal space to separate the adhesive from the optoelectronics transceiver module processing section

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 3

a first cooling component, and the first cooling component is located in the sealing subspace and is in contact with the optoelectronics transceiver module processing section to absorb heat and cool the optoelectronics transceiver module processing section

Methodology Applied

Scientific EffectHeat absorption: Absorption (physical)

Implementation Method 4

the first cooling component liquid passage is configured to allow cooling liquid to flow to cool the optoelectronics transceiver module processing section

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250324551A1Optoelectronics Transceiver Device

Publication Date: 2025.10.16 FORMERICA OPTOELECTRONICS

AI summary

An optoelectronics transceiver device, and the optoelectronics transceiver device comprises an optoelectronics transceiver module and an encapsulation film. The optoelectronics transceiver module comprises an optoelectronics transceiver module processing section, and the encapsulation film covers the processing section to provide a sealed operating environment. In this way, when the optoelectronics transceiver device operates in a cooling liquid, the encapsulation film can prevent the cooling liquid from seeping into the optoelectronics transceiver device and affecting the optoelectronics conversion of the optoelectronics transceiver module, thereby effectively improving the operational efficiency and service life of the optoelectronics transceiver device.