Programmable Optronic Modules with Optical Link Couplers
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Solution Overview
Problem
Existing photonic integrated circuits (PICs) face challenges such as high manufacturing costs, complexity, and inflexibility due to integrated light sources and receivers, which limit their scalability and ability to adopt dynamic interconnection topologies, and are difficult to produce and modify compared to traditional copper-trace boards.
Innovation Solution
A multilayer optronic circuit with programmable optronic modules and optical link couplers that allow for dynamic interconnection topologies, using a surface layer with conductive traces, a transparent optical layer for information propagation, and optical couplers for bidirectional light signals, enabling flexible and scalable configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If photonic integrated circuits integrate light sources and receivers directly into the PIC chip, then the device can be compact and functional, but the manufacturing cost increases significantly and the device becomes obsolete quickly due to constant technological progress
Solution Approach 1:
The system is divided into separate functional modules: external light sources (VCSELs), photonic integrated circuits, and electronic processing units. Each component can be manufactured independently using current technology, avoiding the need to integrate all components into a single chip, thus reducing manufacturing costs while maintaining compact overall device volume.
Solution Approach 2:
Light sources (VCSELs) are extracted from the PIC chip and placed externally. This allows the PIC to be manufactured without the complex and costly integration of light sources, while the external VCSELs can be updated independently as technology progresses, preventing obsolescence.
2Stability of the object's composition
If photonic integrated circuits use fixed integration of components, then the device structure is stable, but the ability to implement dynamic interconnection topologies is limited
Solution Approach 1:
The system implements dynamic interconnection topologies through programmable optical switching within the PIC and electronic routing. The interconnection structure can be reconfigured in real-time to implement different network topologies (star, bus, ring, mesh) without physical modifications, combining structural stability with operational flexibility.
Solution Approach 2:
The photonic integrated circuit is designed as a universal platform that can support multiple interconnection topologies and communication protocols. The same physical infrastructure (waveguides, optical switches, detectors) can be programmed to implement different network configurations, providing both stability and adaptability.
3Loss of energy
If photonic integrated circuits are designed for high bandwidth and speed, then energy efficiency is improved, but the complexity of manufacturing and modification increases
Solution Approach 1:
The system replaces complex mechanical/electrical interconnections with optical waveguides for high-speed data transmission. Photons transmit information through waveguides without the resistance and heat generation associated with copper traces, achieving high bandwidth and energy efficiency while the modular design keeps manufacturing complexity manageable.
4Ease of manufacture
If traditional copper-trace PCBs are used for interconnections, then the infrastructure is simple and inexpensive, but the bandwidth and transmission speed are limited
Solution Approach 1:
The system uses a hybrid architecture combining traditional copper-trace PCBs for power delivery and control signals with photonic waveguides for high-speed data transmission. This composite approach maintains the simplicity and low cost of traditional PCB manufacturing while achieving the high bandwidth and speed of photonic interconnections for data paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables instant implementation of various dynamic interconnection topologies between optronic modules, reducing manufacturing costs and complexity, and allowing for easy reconfiguration without physical modifications, thereby overcoming the limitations of traditional PICs.
Implementation Method 1
a transparent layer forming an information field allowing propagation of light in this volume
Implementation Method 2
the other end comprises a reflective inverted cone whose tip is directed toward the optoelectronic module and concentric with the longitudinal axis of the optical via, the slope of the reflective surface being 45° to omnidirectionally reflect light
Data Source
AI summary
A cluster of optronic modules includes an optronic circuit comprising a printed circuit formed by an insulating plate having conductive tracks; and optronic modules. The optronic modules include metal pins comprising at least one digital signal input/output pin, a ground pin and a power supply pin; and at least one optical connector for the input/output of a bidirectional light signal.