Orbital Circuit Replacement Robot With Solar Solder Heating
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Solution Overview
Problem
The high cost and complexity of replacing failed integrated circuits in satellite systems, especially in space-based applications where obsolete technology can require costly component updates and the failure of a single circuit can derail an entire satellite mission.
Innovation Solution
A space-based robotic system capable of removing and replacing integrated circuits on satellite systems, utilizing a satellite grasper, access mechanism, printed circuit orientation device, temperature sensors, and a processor to control heating and replacement processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spare orbiting satellites are deployed to replace failed satellites, then mission continuity is maintained, but the cost increases significantly
Solution Approach 1:
The invention extracts the core functional component (integrated circuit) from the satellite system and makes it replaceable independently. By focusing on replacing only the failed circuit rather than the entire satellite, the system maintains mission continuity while avoiding the prohibitive cost of launching replacement satellites. The robotic system enables precise extraction and replacement of individual integrated circuits on orbiting satellites.
2Adaptability or versatility
If integrated circuits are replaced in space, then component obsolescence can be addressed, but the system complexity increases
Solution Approach 1:
The invention segments the satellite system into modular components, specifically isolating the integrated circuit as a replaceable unit. This segmentation allows individual circuits to be updated or replaced without affecting the entire satellite system. The robotic system further segments the replacement process into discrete steps: approaching the satellite, locating the target circuit, removing the failed circuit, and installing the replacement circuit.
Solution Approach 2:
The robotic system acts as an intermediary between ground control and the satellite's integrated circuits. It provides the capability to perform complex circuit replacement operations in space without requiring human astronauts to manually intervene. The robot mediates the entire process from satellite approach to circuit replacement, simplifying the overall system architecture by automating the complex tasks.
3Ease of manufacture
If heating is applied to replace integrated circuits, then circuit removal and installation is enabled, but temperature control becomes critical
Solution Approach 1:
The invention incorporates temperature sensing and feedback control mechanisms to monitor and regulate the heating process during circuit replacement. Temperature sensors provide real-time data to the control system, which adjusts the heating intensity accordingly. This feedback loop ensures that the heating remains within safe parameters, preventing damage to surrounding components while still enabling effective solder melting for circuit removal and installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective replacement of integrated circuits in satellite systems, reducing the risk of mission failure due to obsolete technology and minimizing the need for costly spare satellites.
Implementation Method 1
an optical shield having an adjustable window, the optical shield being configured to be positioned over the printed circuit, the optical shield being further configured to be adjusted to allow light to pass substantially only to a designated area of the printed circuit
Implementation Method 2
one or more temperature sensors configured to measure a temperature of the printed circuit
Implementation Method 3
a processor configured to adjust a rate of heating to match a desired heating rate
Data Source
AI summary
A space-based circuit-replacing robotic system and method include a satellite grasper configured to grasp the satellite having a printed circuit onto which an integrated circuit is soldered and the integrated circuit is to be replaced; an access mechanism configured to remove the printed circuit and/or to provide access to the printed circuit; a printed circuit orientation device configured to orient a printed circuit such that sunlight is incident on the printed circuit; one or more temperature sensors configured to measure a temperature of the solder on the printed circuit; a processor configured to adjust a rate of heating to match a desired heating rate; a circuit grasping device configured to position the circuit for replacement; and an optical shield that is configured to be adjusted to allow light to pass substantially only to a desired area of the printed circuit.