Orbital Substrate Polishing Device with Independent Pressure Control
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Solution Overview
Problem
Current substrate polishing devices, particularly rotary-type CMP devices, face challenges in achieving uniform polishing of quadrilateral-shaped substrates due to overpolishing at corners and edges and insufficient polishing at the center, leading to significant variations in polishing amounts across different parts of the substrate.
Innovation Solution
A substrate polishing device with an orbital drive mechanism and independently controllable substrate support chambers that apply vertical forces to the substrate, allowing for localized control of pressing force and ensuring constant contact with the polishing pad, thereby preventing load concentration and ensuring uniform polishing across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a rotary-type CMP device is used to polish quadrilateral-shaped substrates, then the polishing process can be performed efficiently, but the corner parts and edge parts of the substrate are overpolished due to load concentration
Solution Approach 1:
The substrate support table is divided into multiple independently controllable pressure control regions (first, second, third, and fourth pressure control regions). Each region can independently adjust the pressing force applied to different areas of the substrate, allowing localized pressure regulation to prevent overpolishing at corners and edges while maintaining efficient polishing across the entire substrate surface.
2Productivity
If a rotary-type CMP device is used to polish quadrilateral-shaped substrates, then the polishing process can be performed, but the center portion of the substrate receives insufficient polishing
Solution Approach 1:
Different regions of the substrate support table are assigned different pressure control characteristics. The center region (first pressure control region) applies higher pressing force to ensure sufficient polishing, while the corner and edge regions (second, third, and fourth pressure control regions) apply reduced pressing force to prevent overpolishing. This localized quality adjustment ensures uniform polishing across the entire substrate.
3Area of stationary object
If the substrate is large in size, then the polishing capacity is increased, but the polishing amount becomes considerably different between corner parts/edge parts and the center part
Solution Approach 1:
The support table is segmented into multiple pressure control regions that can independently regulate pressure. This segmentation allows large substrates to be polished uniformly by adjusting the pressing force in each region according to its specific requirements, preventing the polishing amount difference between center and corner/edge parts that occurs with large substrates in conventional rotary-type devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves improved uniformity of polishing by preventing load concentration at corners and edges, ensuring consistent polishing rates across the substrate, and eliminating insufficiencies at the center, thus enhancing the overall polishing process for quadrilateral-shaped substrates.
Implementation Method 1
each substrate support chamber may independently apply a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber
Implementation Method 2
each polishing pad support chamber may independently apply a vertical direction force to the polishing pad, and the vertical direction force applied to the polishing pad corresponds to an internal pressure of the polishing pad support chamber
Implementation Method 3
a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
One object of the present invention is to improve the uniformity of polishing in a substrate polishing device for polishing a quadrilateral-shaped substrate. The present application discloses, as one embodiment of the present invention, a substrate polishing device (100) for polishing a quadrilateral-shaped substrate (130), the substrate polishing device (100) including: a surface plate (110); a substrate support mechanism that is attached to the surface plate (110) and that supports the substrate (130); a polishing head mechanism (140) for attaching a polishing pad (150), the polishing head mechanism (140) opposing the surface plate (110); and an orbital drive mechanism (160) for orbitally driving the polishing head mechanism (140). The substrate support mechanism includes: a base plate (121); a plate flow passage (520A, 520C, 520E) provided to the base plate (121); and a plurality of substrate support chambers (510A, 510C, 510E) that are connected to the plate flow passage (520A, 520C, 520E), wherein each substrate support chamber (510A, 510C, 510E) independently applies a vertical direction force to the substrate (130), and the vertical direction force applied to the substrate (130) corresponds to an internal pressure of the substrate support chamber (510A, 510C, 510E).