Organic Aluminum Coating for High-Purity Film Step Coverage
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Solution Overview
Problem
Current methods for forming aluminum-containing films, such as sputtering and chemical vapor deposition, are inefficient and costly, and there is a need for a more effective and cost-effective method to produce high-purity aluminum oxide and aluminum nitride films with superior embedding properties and step coverage, especially on narrow-trench substrates.
Innovation Solution
A composition comprising an organic solvent and an organic aluminum compound with a specific structure is coated on a substrate, followed by heating, electron beam irradiation, ultraviolet irradiation, or plasma treatment in various atmospheres to form high-purity aluminum oxide or aluminum nitride films, allowing for easier and more cost-effective film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sputtering or chemical vapor deposition methods are used to form aluminum-containing films, then film quality and purity can be achieved, but production cost increases and manufacturing efficiency decreases
Solution Approach 1:
The invention changes the chemical parameters of the coating solution by using specifically formulated organic aluminum compounds with controlled hydrolysis rates. This allows the film formation process to achieve high purity through chemical composition control rather than requiring expensive physical vapor deposition equipment and processes.
Solution Approach 2:
The invention replaces the mechanical/physical sputtering system with a chemical solution-based coating system. Instead of using plasma and physical bombardment to deposit aluminum, the invention uses chemical hydrolysis and condensation reactions in solution, significantly reducing equipment complexity and cost while maintaining film quality.
2Ease of manufacture
If conventional coating methods are used to form aluminum-containing films, then equipment cost is reduced, but film formation efficiency and quality on narrow-trench substrates deteriorate
Solution Approach 1:
The invention optimizes multiple parameters of the coating solution including pH, temperature, concentration of aluminum compounds, and additives to control the hydrolysis rate. This enables efficient film formation on complex substrate geometries using simple coating equipment, achieving both low equipment cost and high productivity.
Solution Approach 2:
The invention performs preliminary preparation of the coating solution with controlled hydrolysis before application. This pre-hydrolysis step ensures that the solution is optimally prepared for deposition, allowing rapid and efficient film formation on substrates including narrow-trench structures without requiring complex in-situ reaction equipment.
3Device complexity
If conventional coating methods are used, then equipment simplicity is maintained, but embedding properties and step coverage on narrow-trench substrates are insufficient
Solution Approach 1:
The invention carefully controls the hydrolysis rate parameter of the coating solution by adjusting pH, temperature, and chemical composition. This controlled hydrolysis enables the solution to penetrate and conform to narrow-trench structures, achieving excellent step coverage and embedding properties while maintaining equipment simplicity.
Solution Approach 2:
The invention creates a dynamic coating process where the hydrolysis reaction continues during application and drying. This dynamic chemical transformation allows the coating to adapt and conform to complex substrate topographies, improving step coverage on narrow-trench structures without requiring complex equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of high-purity aluminum oxide or aluminum nitride films with improved embedding properties and step coverage, reducing production costs and enhancing film quality on substrates with complex geometries.
Implementation Method 1
the compound having an Al—N bond on its skeleton or a solution of this compound on a substrate, and heating it at a temperature range of 50 to 1000° C. in an atmosphere containing an oxygen-containing gas
Implementation Method 2
heating it at a temperature range of 50 to 1000° C. in an atmosphere containing an oxygen-containing gas
Implementation Method 3
heating it at a temperature range of 50 to 1000° C. in an atmosphere containing an oxygen-containing gas
Implementation Method 4
The coated layer is subjected to heating, electron beam irradiation, ultraviolet irradiation, plasma treatment, or a combination thereof, in an inactive gas or reducing gas atmosphere to cure the coated layer
Implementation Method 5
The coated layer is subjected to heating, electron beam irradiation, ultraviolet irradiation, plasma treatment, or a combination thereof, in an inactive gas or reducing gas atmosphere to cure the coated layer
Implementation Method 6
The coated layer is subjected to heating, electron beam irradiation, ultraviolet irradiation, plasma treatment, or a combination thereof, in an inactive gas or reducing gas atmosphere to cure the coated layer
Data Source
AI summary
A composition for forming an aluminum-containing film includes an organic solvent, and an organic aluminum compound. The organic aluminum compound has a structure represented by a general formula (1). In the general formula (1), each of R1 to R6 is independently a hydrogen atom or a hydrocarbon group, each of R1s, R2s, R3s, R4s, R5s and R6s is identical or different, and optionally each of R1s, R2s, R3s, R4s, R5s or R6s is linked to one another.