Sinterable Die Attach Films With Organic Binders for Low-Temp Lamination
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Solution Overview
Problem
Sintering films with high metal content pose challenges for lamination and bonding in the semiconductor industry due to surface dryness and the need for high temperatures and pressures, which exceed the capabilities of conventional semiconductor process equipment, especially for lead-free die attach materials requiring suitable thermal and electrical conductivity.
Innovation Solution
Development of sinterable films and pastes with compositions including thermosetting or thermoplastic resin components, conductive fillers, and optional organic diluents, allowing for low-temperature and low-pressure lamination, maintaining wetting ability and achieving proper sintering morphology for die attach applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sintering films with high metal content are used, then thermal and electrical conductivity is improved, but lamination and bonding performance deteriorates due to surface dryness
Solution Approach 1:
The patent uses composite materials by combining metal particles (silver, copper, or aluminum) with organic binder materials. This composite structure allows the metal particles to provide thermal and electrical conductivity while the organic binder maintains surface moisture and enables proper lamination and bonding performance. The composite formulation resolves the contradiction by integrating both functional requirements into a single material system.
Solution Approach 2:
The patent changes the parameter of surface moisture content by introducing organic binder materials that prevent surface dryness. This parameter change allows the film to maintain adequate surface moisture during lamination and bonding processes even while containing high metal content, thus resolving the contradiction between conductivity and manufacturability.
2Strength
If high temperatures and pressures are applied for lamination and bonding, then bonding strength is improved, but equipment capability requirements increase beyond conventional semiconductor process equipment
Solution Approach 1:
The patent changes the processing parameters by using organic binder materials that enable lamination and bonding at lower temperatures and pressures. The organic binder facilitates adhesion at reduced thermal and mechanical energy input, allowing conventional semiconductor process equipment to achieve adequate bonding strength without requiring high-temperature and high-pressure capabilities.
Solution Approach 2:
The organic binder material acts as an intermediary that enables bonding at lower temperatures and pressures. It provides a chemical and physical mechanism for adhesion that does not require the extreme conditions traditionally needed for metal-to-metal bonding, thus reducing equipment capability requirements while maintaining bonding strength.
3Device complexity
If conventional lamination equipment is used, then equipment complexity is reduced, but lamination capability deteriorates due to inability to handle high metal content films
Solution Approach 1:
The patent formulates composite materials with organic binders that make high metal content films compatible with conventional lamination equipment. The organic binder modifies the film's rheological and adhesion properties, enabling conventional equipment to successfully laminate these high-conductivity films without requiring specialized high-temperature or high-pressure capabilities.
Solution Approach 2:
The patent changes the lamination parameters by using organic binder materials that allow processing at lower temperatures and pressures. This parameter change enables conventional lamination equipment to handle high metal content films effectively, resolving the contradiction between equipment simplicity and lamination capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sinterable films and pastes enable efficient lamination and bonding at temperatures of 100°C or lower and pressures of 40 psi or lower, achieving a die shear strength of at least 1.0 kg/mm² at 260°C, suitable for various semiconductor devices with improved processability and flexibility.
Implementation Method 1
The sintering film compositions as described herein can undergo lamination onto a wafer using conventional low temperature and pressure laminators
Implementation Method 2
the die attach material must have suitable thermal and electrical conductivity
Implementation Method 3
the die attach material must have suitable thermal and electrical conductivity
Implementation Method 4
Sintering films and pastes and methods for use thereof
Data Source
AI summary
Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.