Organic Pattern Layer Bonding for Uniform Light-Emitting Displays
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Solution Overview
Problem
Existing display devices face challenges with high-temperature and high-pressure eutectic bonding methods, which can lead to inefficiencies and luminance issues due to uneven bonding metal distribution.
Innovation Solution
A display device design that uses an organic pattern layer for low-temperature and low-pressure bonding of light emitting elements, eliminating the need for eutectic bonding by directly bonding light emitting elements to the substrate using an organic pattern layer and a connection electrode, ensuring consistent and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If eutectic bonding method is used to bond light emitting elements, then bonding strength is improved, but bonding temperature and pressure increase leading to manufacturing complexity and cost
Solution Approach 1:
The patent introduces an organic pattern layer as an intermediary bonding layer between the light emitting element and the substrate. This organic layer enables low-temperature and low-pressure bonding while maintaining reliable electrical and mechanical connections, eliminating the need for high-temperature eutectic bonding processes.
Solution Approach 2:
The patent changes the bonding parameters from high temperature and high pressure (eutectic bonding) to low temperature and low pressure by using the organic pattern layer. This parameter change is achieved through the specific material properties and structural design of the organic layer, which allows effective bonding under milder conditions.
2Strength
If eutectic bonding method is used to bond light emitting elements, then bonding strength is improved, but metal distribution becomes uneven leading to luminance issues
Solution Approach 1:
The organic pattern layer serves as a mediator that distributes the bonding interface uniformly across the light emitting element. This intermediary layer ensures consistent metal distribution and uniform electrical contact, preventing the luminance issues that arise from uneven metal distribution in eutectic bonding.
3Productivity
If low-temperature and low-pressure bonding is used with organic pattern layer, then manufacturing efficiency and reliability are improved, but bonding strength may be reduced
Solution Approach 1:
The patent employs a composite structure consisting of the organic pattern layer combined with the connection electrode and light emitting element. This composite design compensates for the potentially reduced bonding strength of low-temperature bonding by integrating multiple functional layers that collectively provide robust mechanical and electrical connections.
Solution Approach 2:
The connection electrode is designed with a curved surface that contacts the light emitting element. This curved geometry increases the contact area and distributes the mechanical stress more evenly, enhancing the overall bonding strength and reliability of the low-temperature bonding interface.
Data Source
AI summary
A display device includes an electrode disposed on a substrate, an organic pattern layer disposed on the substrate and spaced apart from the electrode, a light emitting element disposed on the organic pattern layer, the light emitting element including a contact electrode contacting the organic pattern layer, a first semiconductor layer, an active layer, and a second semiconductor layer sequentially disposed on the contact electrode and a connection electrode electrically connecting the electrode to the contact electrode, and the connection electrode is disposed along an upper surface of the electrode, a side surface of the organic pattern layer, and a side surface of the contact electrode.