Organic Bridge Interconnect Structure for CTE-Matched Multi-Die Packaging
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Solution Overview
Problem
The integration of multiple dies in processing units within traditional multi-chip modules faces challenges due to a significant mismatch in the coefficient of thermal expansion between organic package substrates and silicon bridges, leading to delamination and cracking, and the complexity of embedding ultra-thin silicon bridges within the substrate.
Innovation Solution
The use of an organic bridge made from an organic polymer, such as epoxy, without a substrate, which conforms to the substrate's contours and minimizes inter-material issues by providing high-density interconnects with better adhesion, allowing for easier integration and reduced manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If silicon bridges are used to achieve high-density interconnects, then the IO capacity and wiring density are improved, but the coefficient of thermal expansion mismatch causes delamination and cracking
Solution Approach 1:
The patent changes the material parameter of the bridge from silicon to organic material, which has a coefficient of thermal expansion matching the organic substrate. This parameter change eliminates the thermal expansion mismatch while maintaining the high-density interconnect capability, thus resolving the contradiction between IO capacity and reliability
Solution Approach 2:
The patent uses organic material for the bridge that is compatible with the organic substrate, creating a composite structure with matched thermal properties. This composite approach allows high-density interconnects without the delamination and cracking issues associated with silicon-organic interfaces
2Quantity of substance
If silicon bridges are embedded within the substrate to increase local IO, then the interconnect density is improved, but the ultra-thin silicon bridge makes embedding challenging
Solution Approach 1:
The patent changes the material from silicon to organic material, which can be formed using standard organic substrate processing techniques. This eliminates the challenges of embedding ultra-thin silicon bridges while achieving the same high-density interconnect goal
Solution Approach 2:
The organic bridge is formed as part of the organic substrate manufacturing process itself, using the same fabrication techniques. This self-integrated approach eliminates the need for separate, complex embedding steps required for silicon bridges
3Adaptability or versatility
If multiple process steps are used to produce MCM after silicon bridge placement, then the manufacturing flexibility is improved, but the process itself leads to cracking and delamination
Solution Approach 1:
By changing the bridge material to organic, the patent enables the use of standard organic substrate processing steps without causing cracking or delamination. This maintains manufacturing flexibility while ensuring structural integrity throughout the process
Data Source
AI summary
Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.