Organic Circuit Substrate With Metalized Waveguide Cavity
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Solution Overview
Problem
Existing high-frequency circuit substrates face challenges in minimizing signal attenuation and manufacturing costs while maintaining optimal electrical properties for millimeter wave applications.
Innovation Solution
A circuit substrate integrating a waveguide directly into an organic substrate with a metalized cavity, electrically connected to active components via metallic supply lines, utilizing a multi-layer structure with liquid-crystalline polymer and copper layers to reduce losses and enhance efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If waveguides are connected to substrates with minimal loss by soldering to pads, then electrical connection is achieved, but signal attenuation increases and manufacturing complexity increases
Solution Approach 1:
The waveguide structure is merged directly with the substrate by embedding the waveguide cavity within the substrate material itself, eliminating the need for separate soldering connections between waveguides and substrate pads. This integration reduces the number of interfaces and connection points where signal loss occurs, while also simplifying the manufacturing process by combining what were previously separate assembly steps into a unified structure.
Solution Approach 2:
The waveguide cavity is nested within the substrate, with the substrate material surrounding and containing the waveguide structure. This nesting approach allows the waveguide to be embedded directly in the substrate without requiring external mounting or soldering connections, thereby reducing signal attenuation at interfaces and simplifying the overall device architecture.
2Loss of energy
If conventional substrates with dielectric material are used, then component mounting is enabled, but signal losses increase due to the lossy dielectric
Solution Approach 1:
The substrate is designed with spatially varying properties: regions containing waveguide cavities use low-loss dielectric material to minimize signal attenuation, while other regions maintain standard dielectric properties to enable component mounting and electrical connections. This local differentiation allows the substrate to simultaneously achieve low signal loss in critical transmission paths while maintaining the versatility needed for component assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal attenuation and manufacturing costs, enabling more efficient high-frequency signal transmission and potentially offering better market positioning through improved performance and lower production expenses.
Implementation Method 1
Waveguides are well-known in themselves. They are used as electrical conductors for very high frequencies above 10 GHz. Compared to other known electrical connections, such as coaxial cables, waveguides exhibit the lowest losses because they do not contain a lossy dielectric.
Implementation Method 2
In a currently preferred embodiment of the circuit substrate, the substrate material comprises a liquid-crystalline polymer (LCP).
Implementation Method 3
In further embodiments, the circuit substrate has a multilayer structure comprising at least two substrate material layers with an intermediate structured metal layer, particularly a copper layer.
Data Source
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AI summary
Circuit substrate of an electronic high-frequency component, comprising an organic substrate material and at least one cavity incorporated into the substrate material, at least partially provided with a metal layer at its boundary surfaces and acting as a waveguide for electrical signals with a carrier frequency of 10 GHz or more, which is directly adjacent to an active component and is electrically connected to such a component either by means of this or via a metallic conductor, in particular stripline, projecting into the cavity