Organic Electronic Device Encapsulation Structure
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are prone to oxidation and moisture penetration, leading to durability issues and limited lifespan, especially under high temperature and high humidity conditions.
Innovation Solution
An encapsulating structure comprising a side encapsulation layer with a specific tensile modulus and viscosity range, combined with a top encapsulation layer, effectively blocks moisture and oxygen, incorporating a moisture adsorbent to manage stress and maintain shape retention, while the ratio and properties of the layers ensure durability and moisture barrier performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single encapsulation layer is used, then the device structure is simple, but the moisture and oxygen blocking performance is insufficient
Solution Approach 1:
The encapsulation structure is divided into three distinct layers: a bottom encapsulation layer, a side encapsulation layer, and a top encapsulation layer. Each layer serves specific protective functions, with the side encapsulation layer specifically addressing edge protection needs. This segmentation allows optimized moisture and oxygen blocking performance without requiring a single overly complex layer.
Solution Approach 2:
The encapsulation layers are formed using composite material compositions with specific tensile modulus ranges. The bottom and top encapsulation layers have a tensile modulus of 0.01 to 10 GPa, while the side encapsulation layer has a tensile modulus of 0.01 to 5 GPa. These composite materials provide enhanced barrier properties against moisture and oxygen penetration.
2Reliability
If the encapsulation layer has high rigidity to block moisture effectively, then the moisture barrier performance improves, but the shape retention under stress deteriorates
Solution Approach 1:
The tensile modulus of the encapsulation layers is precisely controlled within specific ranges to balance rigidity and flexibility. The bottom and top encapsulation layers are designed with a tensile modulus of 0.01 to 10 GPa, while the side encapsulation layer has a tensile modulus of 0.01 to 5 GPa. This parameter optimization ensures sufficient rigidity for moisture blocking while maintaining adequate flexibility for shape retention under thermal and mechanical stress.
3Stability of the object's composition
If the side encapsulation layer has high tensile modulus to provide structural support, then the structural stability improves, but the stress management and lifting resistance at high temperature and humidity deteriorates
Solution Approach 1:
The side encapsulation layer is designed with a specifically optimized tensile modulus range of 0.01 to 5 GPa, which is lower than conventional rigid encapsulation materials. This parameter adjustment allows the layer to flexibly accommodate thermal expansion and contraction stresses during high temperature and humidity conditions, preventing lifting while maintaining structural stability through its position and bonding characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulating structure effectively secures the lifetime of organic electronic devices by blocking external moisture and oxygen, maintaining reliability at high temperature and humidity, and enhancing shape retention characteristics.
Implementation Method 1
incorporating a moisture adsorbent to manage stress and maintain shape retention
Implementation Method 2
capable of effectively blocking water or oxygen introduced from the outside into the organic electronic device
Data Source
Figure 1
AI summary
The present application relates to an organic electronic device, and provides the organic electronic device including an encapsulating structure capable of effectively blocking water or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device and implementing endurance reliability of the encapsulating structure at high temperature and high humidity, and having high shape retention characteristics.