Organic Electronic Device Encapsulation via Segmented Printed Patterns
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are prone to oxidation and moisture ingress, leading to durability issues and reduced lifespan due to sensitivity to environmental factors.
Innovation Solution
A method involving the application of an encapsulating composition to form a printed pattern on an organic electronic element, combining primary and secondary printed patterns with specific pitches and widths, followed by planarization and curing, to create a sealing structure with an inorganic layer, enhancing adhesion and flatness while blocking moisture and oxygen.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an encapsulating composition is applied to seal the organic electronic element, then moisture and oxygen penetration is blocked, but the organic layer exhibits poor flatness and adhesion
Solution Approach 1:
The encapsulating composition is applied in a segmented printing pattern rather than as a continuous layer. The pattern includes first printed patterns extending in a first direction and second printed patterns extending in a second direction, creating a grid-like structure that provides both sealing function and structural support for flatness and adhesion.
Solution Approach 2:
The invention introduces a two-dimensional printed pattern structure with patterns extending in both first and second directions (orthogonal or oblique). This dimensional approach transforms the conventional single-layer sealing into a multi-directional network that simultaneously achieves moisture blocking and mechanical stability.
2Reliability
If the encapsulating composition is applied in a continuous layer, then sealing is achieved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The continuous encapsulating layer is segmented into discrete printed patterns arranged in a systematic grid. This segmentation simplifies the manufacturing process by enabling pattern-based deposition methods while maintaining the sealing function through the interconnected pattern structure.
Solution Approach 2:
The encapsulating composition is selectively applied only where needed in the printed pattern configuration, rather than covering the entire surface uniformly. This local quality approach reduces material usage and simplifies the manufacturing process while maintaining effective sealing at critical locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively improves the flatness and adhesion of the organic layer, thereby extending the lifetime of organic electronic devices by creating a robust moisture barrier.
Implementation Method 1
it may be laminated on the organic electronic element together with a protective layer and/or an inorganic layer, which is described below, to form a sealing structure
Data Source
AI summary
The present application relates to a method for preparing an organic electronic device, and the organic electronic device prepared by the same, the method for preparing an organic electronic device can improve flatness and adhesion of an organic layer in a process of sealing an organic electronic element to effectively block moisture or oxygen from the outside, thereby securing the lifetime of the organic electronic device.