Organic Diode Electroplated Metal Conductor for Voltage Distribution
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Solution Overview
Problem
Large area organic diodes, such as OLEDs and photodiodes, face issues with inhomogeneous luminance and voltage drops due to the high resistivity of thin electrodes, leading to complications in manufacturing and aesthetic concerns from embedded metal grids.
Innovation Solution
An organic diode device with an anode and cathode layer, each having contact areas on a face covered by a barrier layer with openings for electroplated metal conductors, providing even voltage distribution and protection, allowing for easy manufacturing and attractive appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal grid is embedded inside the thin transparent electrode to improve conductivity, then voltage distribution is improved, but manufacturing complexity increases and aesthetic appearance deteriorates
Solution Approach 1:
The barrier layer is formed on the electrode surface before the metal grid is deposited, pre-establishing a protective and insulating foundation that simplifies subsequent manufacturing steps and eliminates the need for complex lead isolation structures
Solution Approach 2:
The barrier layer acts as an intermediary between the thin transparent electrode and the metal grid, providing both electrical insulation and mechanical support, which simplifies the overall structure by eliminating the need for complex isolation mechanisms
2Reliability
If a metal grid is embedded inside the thin transparent electrode to improve conductivity, then voltage distribution is improved, but the number of electrical leads increases making the appearance unattractive
Solution Approach 1:
The harmful visual aspect of exposed electrical leads is extracted and removed by covering them with the barrier layer, which insulates and conceals the metal grid while maintaining its electrical function, thus preserving aesthetic appearance
Solution Approach 2:
The barrier layer serves as an intermediary that allows the metal grid to perform its voltage distribution function while simultaneously hiding it from view, resolving the conflict between functionality and aesthetics
3Reliability
If the electrode thickness is increased to reduce resistivity, then conductivity is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention uses a composite structure combining the thin transparent electrode with a metal grid supported by a barrier layer, achieving high conductivity without increasing electrode thickness or manufacturing complexity
Solution Approach 2:
Instead of increasing thickness in the vertical dimension, the invention adds a metal grid in the planar dimension, supported by a barrier layer, thereby improving conductivity without affecting electrode thickness or manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures even luminance or current distribution across large areas, improved conductivity, and simplified manufacturing, while protecting the organic diode structure and maintaining high conductivity at a low cost.
Implementation Method 1
a barrier layer being located on said first face to hermetically cover said structure
Implementation Method 2
at least one first metal conductor being electroplated on said barrier layer and being in contact with said first set of contact areas via said first set of openings in said barrier layer
Data Source
AI summary
An organic diode device (1) comprises an organic diode structure (2) having an anode layer (12), a cathode layer (13) and an organic layer (14). One of the anode layer (12) and the cathode layer (13) has a set of contact areas (19, 20) that are distributed over a face (15) of said structure (2). A barrier layer (16) hermetically covers said structure (2) and is provided with a set of openings (23, 24) aligned with said set of contact areas (19, 20). A metal conductor (5) has been electroplated on said barrier layer (16) and contacts the set of contact areas (19, 20) via the set of openings (23, 24). A method of forming such a device comprises forming the structure (2), forming the barrier layer (16) with the set of openings (23, 24), and exposing said structure (2) to an electroplating process to form the metal conductor (5).