Organic EL Exposure Chip Layout for Moisture-Resistant Imaging
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Solution Overview
Problem
Existing solid-state exposure type exposure apparatuses face issues with organic EL elements deteriorating due to moisture and oxygen intrusion through gaps between light-emitting element arrays, leading to non-illuminated states, which can occur during manufacturing or after use.
Innovation Solution
The exposure apparatus is designed with light-emitting chips arranged in a staggered manner, ensuring an interval of at least 20 micrometers between the silicon substrate edge and the light-emitting element array, protected by a sealing film made of insulating inorganic material, and optionally a metal film to prevent air intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the gap between light-emitting element arrays is reduced to improve light introduction efficiency, then light can be efficiently introduced into the rod lens array, but the interval between edges of light-emitting chips and light-emitting element arrays becomes insufficient, increasing likelihood of deterioration due to moisture and oxygen intrusion
Solution Approach 1:
A sealing film is formed to cover the light-emitting element array, creating a protective barrier that prevents moisture and oxygen from reaching the organic EL elements. This thin film structure allows the gap to be reduced for better light efficiency while the sealing film maintains protection against air intrusion.
Solution Approach 2:
The sealing structure uses composite materials including an inorganic insulating material as the base sealing film, and optionally a metal film layered on top. This composite approach provides enhanced protection against moisture and oxygen penetration while maintaining the necessary interval geometry for light efficiency.
2Use of energy by moving object
If organic EL elements are used to consume less power, then power consumption is reduced compared to inorganic LEDs, but the elements are susceptible to deterioration from moisture and oxygen intrusion through gaps
Solution Approach 1:
The sealing film acts as a protective barrier that shields the organic EL elements from moisture and oxygen in the air. This allows the use of low-power organic EL elements without compromising their reliability, as the sealing film prevents the environmental factors that would otherwise cause deterioration.
Solution Approach 2:
The sealing film creates a protected environment around the organic EL elements, effectively isolating them from the reactive atmosphere containing moisture and oxygen. This allows the organic EL elements to operate in a stable, inert-like condition that prevents deterioration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the exposure apparatus by preventing deterioration of organic EL elements, maintaining efficient light introduction and reducing the likelihood of non-illuminated states.
Implementation Method 1
a rod lens array that images light from the light-emitting element arrays of the plurality of light-emitting chips onto a surface of the photosensitive member
Implementation Method 2
a light-emitting element array that is an array of organic electro luminescence (EL) elements
Data Source
AI summary
An exposure apparatus includes: light-emitting chips arranged in a staggered manner along a reference line that is parallel to an axial direction of a photosensitive member, each of which has a silicon substrate and a light-emitting element array that is an array of organic electro luminescence (EL) elements formed on a first surface of the silicon substrate; and a rod lens array that images light from the light-emitting element arrays of the light-emitting chips onto a surface of the photosensitive member. An interval between a first side of the silicon substrate of each light-emitting chip and the light-emitting element array of the light-emitting chip is equal to or larger than 20 micrometers, the first side being parallel to the reference line and closer to the reference line among sides of the silicon substrate.