Organic EL Encapsulation via Patterned Structure
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Solution Overview
Problem
Conventional encapsulation methods for organic electroluminescent apparatuses fail to provide effective water-resistance and oxygen-resistance, particularly at the film edges and in flexible devices, leading to moisture and oxygen penetration that damages the organic light-emitting device layer.
Innovation Solution
A patterned structure layer with concave-convex surfaces is introduced in the non-light-emitting region, combined with a multi-layer encapsulation film comprising inorganic and organic layers, which extends the path for moisture and oxygen entry, improving water-resistance and oxygen-resistance by creating a more extensive and effective barrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cover is adhered to the substrate to achieve water-resistant and oxygen-resistant effects, then the reliability of the organic electroluminescent apparatus is improved, but the thickness of the entire apparatus is increased
Solution Approach 1:
The patent uses a thin film encapsulation layer formed by atomic layer deposition (ALD) to provide water and oxygen resistance without significantly increasing device thickness. This thin film approach replaces traditional thick cover adhesions while maintaining protective functionality.
Solution Approach 2:
The patent replaces mechanical adhesion methods with chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes to form encapsulation layers. This substitution of mechanical systems with vapor-phase deposition methods enables thinner, more uniform protective layers.
2Reliability
If a conventional encapsulation film is formed by stacking multiple inorganic films and organic films using vacuum coating process, then water-resistant and oxygen-resistant effects are achieved, but shadow effects occur at film edges and patterned covering is poor
Solution Approach 1:
The patent replaces vacuum coating processes with atomic layer deposition (ALD) and chemical vapor deposition (CVD) methods. These vapor-phase deposition techniques provide superior conformal coverage and eliminate shadow effects at film edges by enabling uniform deposition across complex topographies.
Solution Approach 2:
The patent changes the deposition parameters by using ALD and CVD processes instead of conventional vacuum coating. This parameter change enables better control over film thickness, composition, and uniformity, resulting in improved patterned covering quality and eliminated shadow effects.
Data Source
AI summary
An organic electroluminescent apparatus including a substrate, an organic light-emitting device layer, a patterned structure layer and an encapsulation film is provided. The substrate has a light-emitting region and a non-light-emitting region. The organic light-emitting device layer is disposed on the substrate in the light-emitting region. The patterned structure layer is disposed on the substrate in the non-light-emitting region. The encapsulation film is disposed on the substrate and covers the organic light-emitting device layer and the patterned structure layer. A surface of the encapsulation film on the patterned structure layer is a concave-convex surface, and a surface of the encapsulation film on the organic light-emitting device layer is an even surface.