Organic EL Module Circuit Integration via Through-Hole Pole
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Solution Overview
Problem
Existing organic EL module designs face challenges in maximizing the active area and minimizing thickness, as conventional sealing structures and circuit mounting methods result in non-light emitting fringe portions and increased module thickness, complicating assembly and affecting display quality in devices like small-size mobile terminals and tiling panels.
Innovation Solution
The organic EL module incorporates a configuration with a first terminal on the element substrate, a second terminal on the circuit substrate, and a pole that electrically connects them through a through-hole, allowing the circuit substrate to be positioned above the sealing layer without a hollow sealed space, thereby expanding the active area and reducing module thickness while simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hollow sealing structure is used to seal the organic EL element, then the organic EL element is protected from moisture and atmosphere, but the adhesive region forms a non-light emitting fringe portion reducing the active area
Solution Approach 1:
The invention extracts the sealing function from a separate hollow sealing structure and integrates it into a flat sealing layer that is directly formed on the element substrate. This eliminates the need for adhesive regions between separate substrates, thereby removing the non-light emitting fringe portions and maximizing the active area while maintaining sealing protection.
2Area of stationary object
If circuit elements and circuit substrate are mounted on the sealing substrate, then the active area is increased, but the module thickness increases due to adding component thicknesses
Solution Approach 1:
The invention merges the circuit substrate with the sealing layer by forming the circuit substrate directly on the sealing layer without requiring a separate hollow sealing structure. This integration eliminates the need for additional adhesive regions and reduces the overall module thickness while maintaining the increased active area benefit.
3Ease of manufacture
If circuit elements and circuit substrate are connected to the periphery portion of the substrate, then the connection is established, but the organic EL element cannot be formed in the periphery portion reducing the active area
Solution Approach 1:
The invention moves the circuit substrate from the periphery portion to the rear surface of the element substrate, utilizing the third dimension (depth/thickness) rather than lateral space. This allows the entire front surface of the element substrate to be used for light-emitting organic EL elements, maximizing the active area while maintaining electrical connections through the pole structure.
4Reliability
If a hollow sealing structure with adhesive regions is used, then the sealing is achieved, but the assembling process becomes complicated requiring wiring process and joining process
Solution Approach 1:
The invention combines multiple functions into a single integrated structure: the sealing layer simultaneously provides sealing protection and serves as the base for the circuit substrate. This integration eliminates the need for separate adhesive regions and simplifies the assembling process by reducing the number of discrete joining and wiring steps required.
Data Source
AI summary
An organic EL module includes an element substrate on which at least one organic EL element is formed, a first terminal provided on the element substrate and is drawn out from the electrode of the at least one organic EL element, a second terminal facing the first terminal and provided on a circuit substrate, and a pole that electrically connects the first terminal with the second terminal through a through-hole of the circuit substrate.