Organic EL Panel Buffer Layer for Fuse Heat Protection

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Solution Overview

Problem

Organic electroluminescent panels with resin substrates face damage from impact and heat generated by overcurrent melting disconnection of fuse parts, which can also compromise the sealing performance of barrier layers.

Innovation Solution

An organic EL panel design featuring a support with organic EL elements, connecting wire pairs, and a sealing film, where a buffer layer is placed between the support and the fuse part of the connecting wire to absorb heat and stress, and a void-containing layer is used to prevent reconnection and buffer stress during melting disconnection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a fuse part is provided on connecting wire pairs to block short-circuit current, then current leakage damage to organic EL elements is prevented, but heat and impact from melting disconnection can damage the resin substrate and barrier layer

Engineering Contradiction:
Improveprevention of current leakage damageVSAvoidheat and impact damage to substrate and barrier layer
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A buffer layer is introduced as an intermediary component between the fuse part and the resin substrate. This buffer layer absorbs the heat and impact generated when the fuse part melts during short-circuit protection, preventing direct transmission of harmful thermal and mechanical energy to the resin substrate and barrier layer, thus resolving the contradiction between effective fuse protection and substrate damage prevention

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The buffer layer is pre-positioned between the fuse part and substrate to provide cushioning protection before any short-circuit event occurs. This preemptive measure ensures that when the fuse part melts and generates heat and impact, the damage is contained and absorbed by the buffer layer, protecting the critical substrate and barrier layer from harm

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively prevents damage to the support and sealing layer from melting disconnection, enhancing the durability and reliability of the organic EL panel by buffering heat and stress, thus preventing damage from short circuits and maintaining the integrity of the panel.

Implementation Method 1

a buffer layer is provided between the support and the fuse part

Methodology Applied
Scientific EffectHeat absorption: Heat Sink

Implementation Method 2

the fuse function causes melting disconnection by overcurrent during short circuit due to current leakage

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentUS9444071B2Organic electroluminescent panel
Publication Date: 2016.09.13 PIONEER IP
  • US9444071B2 patent drawing
  • US9444071B2 patent drawing
  • US9444071B2 patent drawing

AI summary

[Problem]Provided is an organic EL panel in which on a support supporting at least one organic EL element, a connecting wire for supply of power to the organic EL is disposed, and which is capable of preventing damage of the support by heat and impact caused by melting disconnection of a fuse part that is provided in the connecting wire.[Solution Means]A buffer layer is disposed between a face supporting the connecting wire on the support and the fuse part.