Organic EL Device Sealing Layer with Buffer

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Solution Overview

Problem

The existing organic EL devices have insufficient sealing performance, leading to moisture invasion and the formation of dark spots due to oxidation of electrode layers, resulting in short circuits and unlit areas.

Innovation Solution

A double sealing structure is implemented, comprising a silicon alloy layer covered with a hard epoxy resin layer, and a buffer layer with flexibility is interposed between the silicon alloy layer and the epoxy resin layer to absorb stress and prevent short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a silicon alloy layer is used as a sealing layer, then moisture blocking capability is improved, but the sealing performance is still insufficient and dark spots occur

Engineering Contradiction:

Improvesealing performanceVSAvoidmoisture invasion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies composite materials by combining a silicon alloy layer with a hard epoxy resin layer to form a dual-layer sealing structure. The silicon alloy layer provides moisture blocking capability while the hard epoxy resin layer enhances mechanical protection and sealing effectiveness, together preventing moisture invasion and dark spot formation more effectively than the silicon alloy layer alone.

Inventive Principle:

Principle #40Composite materials

2Reliability

If a hard epoxy resin layer is added to cover the silicon alloy layer, then sealing performance is improved, but stress accumulation may cause short circuits

Engineering Contradiction:

Improvesealing performanceVSAvoidstress resistance

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent introduces a buffer layer as a flexible intermediate structure between the silicon alloy layer and the hard epoxy resin layer. This buffer layer absorbs mechanical stress and prevents stress accumulation that could lead to short circuits, while maintaining the enhanced sealing performance provided by the hard epoxy resin layer.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If a double sealing structure is implemented, then moisture blocking is improved, but device complexity increases

Engineering Contradiction:

Improvesealing performanceVSAvoidsealing structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the sealing function into three distinct layers: a silicon alloy layer for moisture blocking, a buffer layer for stress absorption, and a hard epoxy resin layer for mechanical protection. This segmentation allows each layer to perform its specific function optimally while collectively providing superior sealing performance compared to a single-layer structure.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS9373815B2Sealing layer of organic EL device

Publication Date: 2016.06.21 KANEKA CORP

AI summary

Provided is an organic EL device which can prevent invasion of moisture to an organic EL element. The organic EL device has an organic EL element in which a first electrode layer, a functional layer, and a second electrode layer are stacked in sequence on a transparent substrate having a planar expanse, and an inorganic sealing layer for sealing at least an emission area of the organic EL element. A soft adhesion layer is stacked directly onto the inorganic sealing layer with a planar expanse, and the soft adhesion layer is made of a resin, and has flexibility.