Organic EL Display Terminal Structure Merging
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Solution Overview
Problem
Top-emission-type organic EL display devices face high manufacturing costs and reliability issues due to complex structures and the need for multiple layers, which hinder cost reduction and brightness enhancement.
Innovation Solution
The use of a metal or metal alloy SD line that reflects light, with the uppermost layer being a transparent conductive film like ITO, IZO, or MoO3, and forming terminal portions on the same layer as SD lines or gate electrodes, reduces the number of layers and manufacturing steps, enhancing reliability and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers and complex structures are used in top-emission-type organic EL display devices, then device functionality is achieved, but manufacturing cost increases and reliability decreases
Solution Approach 1:
The patent merges the terminal portion structure with the existing SD line or gate electrode layer, making them formed on the same layer. This integration eliminates the need for separate terminal portion layers and reduces overall structural complexity while maintaining electrical functionality and improving reliability through reduced interface points.
Solution Approach 2:
The SD line or gate electrode layer serves dual functions: it provides electrical connection for the TFT circuit and simultaneously forms the terminal portion for the organic EL layer. This multi-functionality reduces the number of required layers and simplifies the overall device structure while improving manufacturing reliability.
2Ease of manufacture
If multiple layers are used in top-emission-type organic EL display devices, then device functionality is achieved, but manufacturing cost increases
Solution Approach 1:
The terminal portion is merged with the SD line or gate electrode layer, reducing the total number of layers that need to be deposited and processed. This directly lowers manufacturing costs by reducing material usage, processing time, and equipment utilization while maintaining all necessary device functions.
Solution Approach 2:
By making the terminal portion and SD line/gate electrode co-formed on the same layer, the patent achieves multi-functionality that reduces the number of manufacturing steps. This universality approach simplifies the fabrication process and reduces overall manufacturing cost without compromising device performance.
3Reliability
If terminal portions are formed separately from SD lines, then electrical connection is ensured, but manufacturing complexity and cost increase
Solution Approach 1:
The terminal portion and SD line are merged into a single formed layer, eliminating separate formation processes. This integration maintains reliable electrical connections while significantly improving manufacturing efficiency by reducing the number of deposition and patterning steps required.
Solution Approach 2:
The same layer serves both as the SD line for TFT connection and as the terminal portion for the organic EL layer. This multi-functional design ensures reliable electrical connections while streamlining the manufacturing process and improving overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and improves the reliability of terminal portions while maintaining high display performance by using chemically stable materials and optimizing the structure to minimize contamination and enhance light emission efficiency.
Implementation Method 1
each SD line includes a layer made of metal or metal alloy which reflects light
Data Source
AI summary
TFTs are formed on a substrate. An interlayer insulation film is formed on the substrate to cover the TFTs. Lower layer portions of SD lines formed of a multi-layered film which are formed on the interlayer insulation film constitute a lower electrode of an organic EL layer. An uppermost layer of the SD line is formed of a chemically stable metal oxide film, and the SD layer is used as it is. On the other hand, as a lower electrode of an organic EL layer, an upper layer of the SD line is removed and an Al—Si, alloy film of the SD line is used. Due to such a constitution, it is possible to reduce a cost by shortening steps while holding the performance and the reliability of organic EL.