Organic Film Composition for Uniform Wafer Coating and EBR Hump Suppression
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Solution Overview
Problem
The challenge is to develop a composition for forming an organic film that exhibits excellent in-plane uniformity and filling properties, while also preventing the formation of humps during the Edge Bead Removal (EBR) process, which can lead to defects in semiconductor manufacturing.
Innovation Solution
A composition comprising a polymer with a specific repeating unit, a resin for forming an organic film, and a solvent, where the polymer is preferably contained in an amount of 0.01 to 5 parts by mass based on 100 parts by mass of the resin, and the film is formed by spin-coating and subsequent baking at temperatures between 100°C and 600°C to cure the composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional organic film composition is used, then the film formation process is simple, but the in-plane uniformity and filling properties are insufficient
Solution Approach 1:
The patent employs a composite material system consisting of three specific components: a polymer (A) with repeating units of formula (1), a resin (B) for forming the organic film, and a solvent (C). This composite composition achieves excellent in-plane uniformity and filling properties by combining materials with complementary characteristics, where each component contributes specific functional properties to the overall film formation performance.
Solution Approach 2:
The patent optimizes the composition by controlling the content ratio of polymer (A) to resin (B) within a specific range (0.01 to 5 parts by mass of polymer per 100 parts by mass of resin). This parameter control ensures that the film formation properties are optimized, achieving both good in-plane uniformity and effective hump suppression during the EBR process.
2Reliability
If a conventional organic film composition is used, then the material formulation is simple, but hump formation occurs during the EBR process
Solution Approach 1:
The composite material system comprising polymer (A), resin (B), and solvent (C) works synergistically to suppress hump formation during the EBR process. The specific combination and ratio of these components control the film's flow and curing characteristics, preventing the edge bead from forming excessive height that would create humps after removal.
Solution Approach 2:
By precisely controlling the content ratio of polymer (A) to resin (B) within the specified range, the patent optimizes the film's rheological properties and curing behavior. This parameter optimization ensures uniform film thickness and prevents edge bead accumulation, thereby suppressing hump formation during EBR processing.
3Manufacturing precision
If the polymer content is increased to improve film uniformity, then the in-plane uniformity improves, but the viscosity increases making film formation difficult
Solution Approach 1:
The patent optimizes the polymer (A) content within a balanced range (0.01 to 5 parts by mass per 100 parts by mass of resin (B)). This controlled parameter range ensures sufficient polymer content to achieve good in-plane uniformity while maintaining the composition's fluidity and ease of film formation, avoiding excessive viscosity that would complicate the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent film-formability and filling properties, effectively suppressing hump formation during the EBR process, leading to improved precision and reduced defects in semiconductor device manufacturing.
Implementation Method 1
spin-coating and subsequent baking
Implementation Method 2
baking at temperatures between 100°C and 600°C to cure the composition
Data Source
AI summary
The present invention is a composition for forming an organic film, containing: (A) a polymer having a repeating unit represented by the following general formula (1); (B) a resin for forming an organic film; and (C) a solvent, where R in the general formula (1) represents a saturated or unsaturated divalent organic group having 2 to 30 carbon atoms. This provides: a composition for forming an organic film which is excellent in film-formability (in-plane uniformity) on a substrate (wafer) and filling property and in which humps in an EBR process are suppressed; a method for forming an organic film, using the composition; and a patterning process.