Organic Film Composition for Heat-Resistant Pattern Planarization
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Solution Overview
Problem
Existing photoresist compositions face challenges in achieving high resolution and etching resistance while maintaining film thickness, leading to pattern collapse and inadequate pattern transfer in semiconductor manufacturing, especially with the increasing complexity of substrate structures and demands for improved planarization and filling properties.
Innovation Solution
A composition for forming an organic film using a compound or polymer with specific molecular structures, such as those described by general formulas (1) and (3), which provide excellent heat resistance, filling, and planarizing properties, along with adhesiveness to the substrate, and a patterning process involving multiple layers to enhance precision and precision pattern transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the photoresist film thickness is reduced to maintain resolution with finer patterns, then the resolution performance is improved, but the etching resistance is lowered and pattern collapse occurs
Solution Approach 1:
The patent divides the single photoresist film into multiple layers: a lower photoresist film with high etching resistance and an upper photoresist film with high resolution. This segmentation allows each layer to specialize in one function, resolving the contradiction between etching resistance and resolution performance.
Solution Approach 2:
The patent uses composite material structure with different resin compositions in each layer. The lower layer uses resins with high etching resistance (such as those with aromatic rings), while the upper layer uses resins optimized for resolution (with appropriate absorbance characteristics). This composite approach allows simultaneous optimization of both properties.
2Reliability
If the photoresist film is thinned to prevent pattern collapse during development, then the aspect ratio is reduced, but the etching resistance is further compromised
Solution Approach 1:
By segmenting the photoresist system into two layers with different thicknesses and functions, the lower layer can be optimized purely for etching resistance without concern for pattern collapse, while the upper layer handles the patterning function. This resolves the contradiction between pattern stability and etching resistance.
3Manufacturing precision
If resins with low absorbance at exposure wavelength are selected to achieve higher resolution, then the resolution is improved, but the etching rate increases under dry etching conditions
Solution Approach 1:
The patent applies local quality by using different resin compositions in different spatial locations (layers). The upper layer uses resins with low absorbance for high resolution, while the lower layer uses resins with high etching resistance. Each layer has locally optimized properties suitable for its specific function.
4Manufacturing precision
If a multilayer resist method is introduced to achieve both high resolution and etching resistance, then the pattern transfer precision is improved, but the process complexity increases
Solution Approach 1:
The patent merges the functions of resolution optimization and etching resistance into a single integrated two-layer photoresist system that can be applied and processed together. This combining approach achieves high pattern transfer precision while avoiding the complexity of separate processing steps for different resist layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition and process enable the formation of an organic film with enhanced thermal flowability, filling, and planarizing properties, allowing precise pattern transfer and improved precision in semiconductor device manufacturing, even on complex substrate structures.
Implementation Method 1
the compound and/or polymer... provide excellent heat resistance, filling, and planarizing properties, along with adhesiveness to the substrate... enhanced thermal flowability
Data Source
AI summary
The present invention is a composition for forming an organic film, containing: a material for forming an organic film shown by the following general formula; and an organic solvent, where R1 represents a hydrogen atom, an allyl group, or a propargyl group, R2 represents a nitro group, a halogen atom, a hydroxy group, an alkyloxy group having 1 to 4 carbon atoms, an alkynyloxy group having 2 to 4 carbon atoms, an alkenyloxy group having 2 to 4 carbon atoms, a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms, a trifluoromethyl group, or a trifluoromethyloxy group, m=0 or 1, n=1 or 2, l=0 or 1, k represents an integer of 0 to 2, W represents a divalent organic group having 1 to 40 carbon atoms, and each V independently represents a hydrogen atom or a linking moiety. This provides a composition for forming an organic film which allows the formation of an organic film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film-formability and adhesiveness to a substrate.