Organic Film Composition for Planarization Without CMP
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for forming organic films in semiconductor manufacturing face challenges in achieving both advanced embedding and planarization properties, particularly in three-dimensional structures, while avoiding thermal decomposition and high costs associated with chemical mechanical polishing.
Innovation Solution
A composition comprising an aromatic ring-containing resin, a polymer with a β-diketone structure in the repeating unit, and a solvent, which enhances thermal fluidity and planarization properties, and a patterning process involving heat treatment to form a cured film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If thermal decomposable polyacetal is added to improve planarization, then film fluidity is enhanced, but thermal decomposition induces shrinkage causing film formation failure and deterioration of embedding property
Solution Approach 1:
The patent changes the chemical structure parameter of the polymer from conventional polyacetal to one containing β-diketone structures, which fundamentally alters the thermal behavior. This structural modification allows the polymer to maintain film fluidity for planarization without undergoing harmful thermal decomposition and shrinkage, thus resolving the contradiction between planarization capability and film formation stability.
Solution Approach 2:
The patent creates a composite organic film system by combining the β-diketone-containing polymer with aromatic ring-containing resin and solvent. This composite approach allows the β-diketone polymer to provide planarization through controlled fluidity while the aromatic resin provides structural stability, preventing shrinkage and maintaining embedding properties during thermal processing.
2Ease of manufacture
If conventional polyethylene or polyethylene glycol is used to improve film formation, then processing is simplified, but solvent solubility, compatibility with main resin, and film formation are poor due to sublimation
Solution Approach 1:
The patent modifies the polymer structure from conventional polyethylene/polyethylene glycol to one containing β-diketone structures. This structural change fundamentally improves solvent solubility and compatibility with aromatic ring-containing resins while eliminating sublimation issues, thereby achieving both ease of manufacture and reliable film formation.
Solution Approach 2:
The β-diketone-containing polymer acts as an intermediary material that bridges the compatibility gap between the aromatic ring-containing resin and the solvent system. Its specific chemical structure enables proper dissolution and interaction, facilitating successful film formation without the sublimation problems of conventional polymers.
3Shape
If CMP process is used to planarize substrate, then flat surface is achieved, but process cost increases significantly
Solution Approach 1:
The patent enables the organic film to self-planarize through the fluidity provided by the β-diketone-containing polymer during spin coating and baking. The film automatically flows to fill in substrate unevenness without requiring external mechanical intervention, thereby eliminating the need for costly CMP processes while achieving the desired substrate flatness.
Solution Approach 2:
The patent replaces the mechanical CMP process with a chemical/physical solution based on the fluidity and self-organizing properties of the β-diketone-containing polymer. Instead of using mechanical abrasion to achieve flatness, the organic film naturally planarizes through controlled flow during thermal processing, substituting a low-cost chemical-physical process for an expensive mechanical one.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a flat organic film with excellent embedding and planarization properties, along with improved heat resistance and etching resistance, suitable for multi-layer resist processes in semiconductor manufacturing.
Implementation Method 1
The polymer containing the β-diketone structure of (B) in a repeating unit can have fluidity by appropriately selecting the structure indicated by L1 contained in the polymer main chain and embed uneven patterns after spin-coating. The fluidity is enhanced by heat, thus, when baked at a high temperature, the polymer flows more and can further improve the flatness of uneven surfaces.
Implementation Method 2
When the composition contains an aromatic ring-containing resin such as (A), etching resistance and processing resistance are good.
Data Source
AI summary
Provided is a composition for forming an organic film which has both embedding and planarization properties, and a method for forming an organic film and a patterning process using the composition. A composition for forming an organic film, containing: (A) an aromatic ring-containing resin; (B) a polymer containing a repeating unit containing a β-diketone structure represented by the following formula (1):wherein L1 is a saturated or unsaturated linear or branched divalent hydrocarbon group having 2 to 20 carbon atoms, RA and RB each are a hydrogen atom, a substituted or unsubstituted linear alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted branched or cyclic alkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aliphatic unsaturated hydrocarbon group having 2 to 20 carbon atoms and containing one or more double or triple bonds, a substituted or unsubstituted heteroalkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, a thiol group, a hydroxy group, an amino group, a carboxy group, or a halogen group; and (C) a solvent.