Organic Film Composition for Gap Filling and Planarization
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Solution Overview
Problem
Existing methods for forming organic films in semiconductor manufacturing face challenges in achieving both advanced embedding and planarization properties, particularly in three-dimensional structures, while avoiding film formation failures and high costs associated with chemical mechanical polishing.
Innovation Solution
A composition comprising an aromatic ring-containing resin, a polymer with a β-diketone structure in the repeating unit, and a solvent is used to form an organic film, which enhances fluidity and thermal flow, ensuring excellent embedding and planarization properties without thermal decomposition or solvent solubility issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If thermal decomposable polyacetal is added to improve planarization, then film fluidity is enhanced, but thermal decomposition induces shrinkage causing film formation failure and deterioration of embedding property
Solution Approach 1:
The patent changes the chemical structure parameter by using a polymer with β-diketone structure instead of thermal decomposable polyacetal. This structural modification allows the material to maintain film fluidity for planarization while avoiding thermal decomposition and shrinkage, thus resolving the contradiction between planarization capability and film formation reliability.
Solution Approach 2:
The patent employs a polymer with β-diketone structure that provides temporary fluidity during the coating process for planarization, then maintains stability during subsequent thermal processing. The material serves its planarization function and then remains stable, effectively replacing the thermal decomposable polyacetal that failed due to shrinkage.
2Ease of manufacture
If conventional polyethylene and polyethylene glycol are used to improve film formation, then processing is simplified, but solvent solubility and compatibility with main resin are poor causing film formation failure
Solution Approach 1:
The patent creates a composite material system by combining the polymer with β-diketone structure with aromatic ring-containing resins. This composite approach improves solvent solubility and compatibility with main resins while maintaining processing simplicity, resolving the contradiction between ease of manufacture and film formation reliability.
3Shape
If CMP process is used to achieve planarization, then flat surface is obtained, but process cost increases significantly
Solution Approach 1:
The patent replaces the mechanical CMP process with a chemical/material-based solution. By incorporating the polymer with β-diketone structure into the organic film composition, the material self-planarizes through controlled fluidity during coating, eliminating the need for expensive CMP machinery and processes while achieving the same flatness result.
4Reliability
If aromatic ring-containing resin is used to improve etching resistance, then processing resistance is enhanced, but fluidity is reduced compromising embedding capability
Solution Approach 1:
The patent merges two materials with complementary properties: aromatic ring-containing resin provides etching resistance while the polymer with β-diketone structure provides fluidity for embedding. The combination creates a synergistic effect where both properties are maintained simultaneously, resolving the contradiction between etching resistance and embedding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition forms a highly planarized organic film with excellent etching and heat resistance, suitable for multi-layer resist processes in semiconductor manufacturing, enabling precise pattern transfer with high accuracy.
Implementation Method 1
The fluidity is enhanced by heat, thus, when baked at a high temperature, the polymer flows more and can further improve the flatness of uneven surfaces
Implementation Method 2
When the composition contains an aromatic ring-containing resin such as (A), etching resistance and processing resistance are good
Implementation Method 3
the β-diketone structure and L 1 are difficult to cause thermal decomposition, and the sublimation of low molecular weight molecules by thermal decomposition can be suppressed
Data Source
Figure 1(A)~1(F)
Figure 2(A)~2(B)
AI summary
Provided is a composition for forming an organic film which has both embedding and planarization properties, and a method for forming an organic film and a patterning process using the composition. A composition for forming an organic film, containing: (A) an aromatic ring-containing resin; (B) a polymer containing a repeating unit containing a β-diketone structure represented by the following formula (1): wherein L1 is a saturated or unsaturated linear or branched divalent hydrocarbon group having 2 to 20 carbon atoms, RA and RB each are a hydrogen atom, a substituted or unsubstituted linear alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted branched or cyclic alkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aliphatic unsaturated hydrocarbon group having 2 to 20 carbon atoms and containing one or more double or triple bonds, a substituted or unsubstituted heteroalkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, a thiol group, a hydroxy group, an amino group, a carboxy group, or a halogen group; and (C) a solvent.