Organic Film Planarizing Composition for Fine Pattern Filling
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Solution Overview
Problem
Current multilayer resist methods for semiconductor device manufacturing face challenges in achieving high planarizing ability, especially in filling patterns with fine structures and maintaining etching resistance, due to limitations in thermal flowability and solvent evaporation rates.
Innovation Solution
A planarizing agent comprising an aromatic-group-containing compound with a molecular weight of 200 to 500, which when blended with a resin and solvent, exhibits reduced complex viscosity above 175°C, enhancing thermal flowability and reducing residue, thereby improving planarization and etching resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a multilayer resist method is used to form patterns with high aspect ratio, then pattern formation capability is improved, but planarizing ability deteriorates due to insufficient thermal flowability
Solution Approach 1:
The patent changes the molecular weight parameter of the aromatic compound to a specific range (200-500) to optimize thermal flowability. This parameter change enables the organic film to achieve adequate planarization while maintaining pattern formation capability in multilayer resist structures
Solution Approach 2:
The patent creates a composite material system combining resin, solvent, and aromatic compound. This composite approach synergistically improves thermal flowability for planarization while preserving the etching resistance and pattern formation properties of the multilayer resist structure
2Shape
If heating temperature is increased to improve thermal flowability, then planarization is improved, but solvent evaporation rate increases causing film formation failure
Solution Approach 1:
The patent introduces aromatic compounds with specific molecular weights (200-500) that modify the viscosity-temperature relationship of the composition. This enables adequate thermal flowability at lower temperatures, preventing excessive solvent evaporation and film formation failure while achieving necessary planarization
Solution Approach 2:
The aromatic compound acts as an intermediary substance that mediates between the resin-solvent system and the heating process. It facilitates thermal flowability enhancement without directly causing solvent evaporation, thus protecting film formation stability during the planarization heating process
3Ease of manufacture
If conventional organic compounds are used as planarizing agents, then film formation is simple, but etching resistance deteriorates due to residue after heat treatment
Solution Approach 1:
The patent specifies aromatic compounds with molecular weights in the range of 200-500, which volatilize completely at heat treatment temperatures. This parameter control ensures no residue remains to interfere with subsequent etching processes, maintaining high etching resistance while keeping the film formation process simple
4Loss of substance
If molecular weight of aromatic compound is decreased to improve volatility, then residue is reduced, but thermal flowability deteriorates
Solution Approach 1:
The patent optimizes the molecular weight parameter to a specific range (200-500) that balances two opposing requirements: low enough to ensure complete volatilization and minimal residue, but high enough to maintain adequate thermal flowability for planarization. This precise parameter control resolves the contradiction between volatility and flowability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high planarization and etching resistance, allowing for precise pattern formation on substrates with complex geometries while maintaining the integrity of the organic film, even after heat treatment.
Implementation Method 1
the blended composition has a temperature range in which a complex viscosity of the blended composition is less than 1.0 Pa·s in a temperature range of 175° C. or higher
Implementation Method 2
weight reduction rate from 30° C. to 190° C. of less than 15%, and has a weight reduction rate from 30° C. to 350° C. of 98% or more
Data Source
AI summary
The present invention is a planarizing agent for forming an organic film, including an aromatic-group-containing compound having a molecular weight represented by a molecular formula of 200 to 500, wherein a blended composition that includes the planarizing agent and a preliminary composition containing an organic film-forming resin and a solvent, and having a complex viscosity of 1.0 Pa·s or more in a temperature range of 175° C. or higher has a temperature range in which a complex viscosity of the blended composition is less than 1.0 Pa·s in a temperature range of 175° C. or higher. This provides a planarizing agent for forming an organic film to yield a composition for forming an organic film having a high planarizing ability; a composition for forming an organic film containing this planarizing agent; a method for forming an organic film using this composition; and a patterning process.