Organic Film Material for Planarizing and Etch-Resistant Patterning
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Solution Overview
Problem
The miniaturization of pattern size in LSIs leads to decreased resolution and increased aspect ratio of photoresist films, resulting in pattern collapse and insufficient dry etching resistance, which complicates the transfer of resist patterns to substrates.
Innovation Solution
A material for forming an organic film comprising a compound with a bisphenol derivative linked with a flexible chain, combined with an organic solvent, which forms a film with excellent adhesive force, heat resistance, and dry-etching resistance, while achieving high filling and planarizing properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the thickness of the photoresist film is reduced to maintain resolution during miniaturization, then the resolution is maintained, but the etching resistance decreases
Solution Approach 1:
The patent divides the single photoresist film into two separate layers: a lower photoresist film that provides etching resistance and an upper photoresist film that provides resolution. This segmentation allows each layer to be optimized for its specific function without compromise.
Solution Approach 2:
The patent transitions from a single-layer structure to a multi-layer structure in the vertical dimension. By stacking multiple photoresist films with different thicknesses and properties, the system achieves both high resolution (through the thin upper layer) and high etching resistance (through the thick lower layer).
2Measurement precision
If the film thickness is reduced, then the resolution is maintained, but the aspect ratio increases causing pattern collapse
Solution Approach 1:
The patent segments the photoresist structure into multiple layers, where the lower layer provides structural support with larger thickness (lower aspect ratio) and the upper layer provides fine pattern definition. This prevents pattern collapse while maintaining resolution.
Solution Approach 2:
The patent uses composite photoresist structures combining different resin types (e.g., novolak-based lower layer and aromatic polymer-based upper layer) with different properties. The composite structure achieves both mechanical stability and optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The organic film material provides high filling and planarizing properties, excellent adhesive force, and improved dry-etching resistance, enabling precise pattern formation and transfer in semiconductor device manufacturing processes.
Implementation Method 1
the organic film material provides high filling and planarizing properties, excellent adhesive force
Implementation Method 2
improved dry-etching resistance, enabling precise pattern formation and transfer
Data Source
AI summary
A material for forming an organic film containing a compound of general formula (1) in which X is an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 is an integer of 2 to 10, R1 is at least one of formulae (2) to (4), where l1 is 0 or 1, and l2 is 0 or 1, and an organic solvent; an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate.