Organic Heat Dissipating Structure for Power Module Thermal Management

Solution Overview

Problem

Conventional power modules face challenges in reducing thermal resistance between the heatsink and ambient, limiting heat dissipation efficiency and leading to increased operating temperatures, which can degrade semiconductor performance and reduce device lifespan.

Innovation Solution

The implementation of an organic heat dissipating structure with protrusions on the substrate's surface or heatsink side, utilizing organic materials with high thermal conductivity fillers, which provides a larger surface area for heat transfer and reduces convective thermal resistance, thereby enhancing heat dissipation performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional high-heat-conductivity heatsink structures are used, then heat dissipation performance is improved, but device volume and weight increase

Engineering Contradiction:

Improveheat dissipation performanceVSAvoiddevice weight

Core Design Contradiction:

Loss of energyVSWeight of moving object

Solution Approach 1:

The patent changes the thermal conductivity parameter of the heatsink material from conventional high-heat-conductivity materials to organic materials with lower thermal conductivity, while compensating through structural optimization (protrusions and cavities) to maintain heat dissipation performance while reducing weight

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses organic composite materials for the heatsink structure, combining organic material with specific thermal properties and optimized geometric structures (protrusions and cavities) to achieve effective heat dissipation with reduced weight compared to conventional metal heatsinks

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If conventional high-heat-conductivity heatsink structures are used, then heat dissipation performance is improved, but device volume increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoiddevice volume

Core Design Contradiction:

Loss of energyVSVolume of moving object

Solution Approach 1:

The patent changes the thermal conductivity parameter of the heatsink material from conventional high-heat-conductivity materials to organic materials with lower thermal conductivity, while compensating through structural optimization (protrusions and cavities) to maintain heat dissipation performance while reducing volume

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses organic composite materials for the heatsink structure, combining organic material with specific thermal properties and optimized geometric structures (protrusions and cavities) to achieve effective heat dissipation with reduced volume compared to conventional metal heatsinks

Inventive Principle:

Principle #40Composite materials

3Loss of energy

If organic heat dissipating structures with protrusions are used, then thermal resistance is reduced and heat dissipation is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal resistanceVSAvoidmanufacturing complexity

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The heatsink structure is segmented into multiple protrusions and cavities, dividing the heat dissipation function into distributed elements that increase surface area and improve thermal resistance while allowing modular manufacturing approaches

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The organic heatsink incorporates a porous structure with protrusions and cavities that increases the effective heat dissipation surface area and enhances convective heat transfer, while the porous nature allows for potential foam-based or injection molding manufacturing processes

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces thermal resistance and improves heat dissipation efficiency, allowing for better temperature management and increased power density while minimizing the need for mechanical fixation and thermal interface materials, thus enhancing the reliability and efficiency of power modules.

Implementation Method 1

configured to transfer heat generated by the power device outwardly

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

reducing convective thermal resistance and enhancing airflow contact

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10297523B2Power module and method for manufacturing the same

Publication Date: 2019.05.21 DELTA ELECTRONICS INC(CN)

AI summary

A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plurality of organic heat dissipating protrusions and it is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.