Display Substrate Organic-Inorganic Insulation for Flexible Bending
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Solution Overview
Problem
Conventional AMOLED display substrates have limited bending resistance due to the use of inorganic interlayer insulation layers, leading to issues such as poor encapsulation, breakdown, and burning of routing wires, which restricts the flexibility and yield of flexible display products.
Innovation Solution
The use of an organic interlayer insulation layer combined with an inorganic insulation layer structure in the display substrate, where the organic layer covers the display area and part of the non-display area, and the inorganic layer surrounds the organic layer, enhancing bending resistance and preventing water vapor ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic interlayer insulation layer is used, then encapsulation and wire protection are provided, but bending resistance is limited and routing wires may break or burn
Solution Approach 1:
The patent uses a composite interlayer insulation structure combining organic and inorganic insulation layers. The organic insulation layer provides flexibility and bending resistance, while the inorganic insulation layer provides encapsulation and protection. This composite structure resolves the contradiction between encapsulation integrity and bending resistance by leveraging the complementary properties of different materials.
Solution Approach 2:
The patent applies different insulation layer configurations to different regions. The organic insulation layer covers the display area and extends to the non-display area, while the inorganic insulation layer is positioned to provide targeted protection. This local differentiation optimizes both bending resistance in the display area and encapsulation in critical regions.
2Adaptability or versatility
If the interlayer insulation layer structure is optimized for bending resistance, then flexibility improves, but encapsulation may fail and routing wires may break
Solution Approach 1:
The composite interlayer insulation structure combines the flexibility of organic materials with the protective encapsulation properties of inorganic materials. This allows the display substrate to achieve both high flexibility for bending applications and reliable encapsulation to prevent moisture ingress and protect routing wires.
3Ease of operation
If conventional poly TFT and PI base are used for temporary local bending, then bending is achieved within a certain range, but bending resistance cannot be improved further
Solution Approach 1:
The patent replaces the conventional PI base with an organic insulation layer that has superior flexibility and bending resistance properties. This composite approach maintains the temporary local bending capability while significantly improving the overall bending resistance of the display substrate.
Data Source
AI summary
A display substrate and a preparation method therefor, and a display panel. The display substrate comprises: a base substrate provided with a display area and a non-display area surrounding the display area; a gate layer located on the base substrate; an interlayer insulation layer, which is located on the side of the gate layer that faces away from the base substrate and comprises a first organic insulation layer and a first inorganic insulation layer, wherein the first organic insulation layer covers the display area and part of the non-display area; a source and drain layer located on the side of the interlayer insulation layer that faces away from the base substrate; and an encapsulation layer, which covers the display area and part of the non-display area.