Organic Insulating Layer for Flexible OLED Display Panels

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Solution Overview

Problem

Conventional organic light emitting diode (OLED) display devices experience cracking due to stress accumulation during bending, particularly in thin film transistors with inorganic dielectric insulating layers, which are prone to cracking when flexed.

Innovation Solution

A display panel design incorporating a substrate, active layer, insulating layers, and metal layers with through holes, utilizing an organic insulating layer made of polyimides to reduce stress and prevent cracking, with a minimum pore size of through holes greater than or equal to 3.5 micrometers, allowing for electrical connections between metal layers and electrodes to support high-pixel-density displays.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an inorganic material is deposited as a dielectric insulating layer, then the insulating performance is improved, but the layer is prone to cracking during bending due to stress accumulation

Engineering Contradiction:
Improveinsulating performanceVSAvoidcrack resistance during bending
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the material parameter from inorganic to organic (polyimide), which fundamentally alters the stress characteristics. Organic materials have different mechanical properties that reduce stress accumulation during bending, preventing cracking while maintaining insulating performance through the inherent electrical insulation properties of polyimide.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs an organic insulating layer made of polyimide as a composite material solution. This organic material combines electrical insulation capabilities with flexible mechanical properties, creating a composite structure that resists cracking during bending while maintaining dielectric functionality.

Inventive Principle:
Principle #40Composite materials

2Strength

If the through hole pore size is increased to reduce stress concentration, then the crack resistance is improved, but the pixel density is reduced

Engineering Contradiction:
Improvecrack resistanceVSAvoidpixel density
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent optimizes the through hole pore size parameter to a specific range (3.5-10 micrometers). This parameter change balances two competing requirements: large enough pores to reduce stress concentration and prevent cracking, but small enough to maintain high pixel density in the display structure.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10818696B2Display panel and fabricating method thereof
Publication Date: 2020.10.27 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US10818696B2 patent drawing
  • US10818696B2 patent drawing
  • US10818696B2 patent drawing

AI summary

A display panel and a fabricating method thereof are provided. The display panel has a substrate, an active layer, an insulating layer, a first metal layer, an organic insulating layer, and a second metal layer. The display panel and the fabricating method thereof use an organic material as a dielectric insulating layer to reduce a problem that cracking is prone to occur when the display panel accumulates a large stress during bending. A minimum pore size of a through hole of the organic material is greater than that of an inorganic material, which is disadvantageous of a high-pixel-density display panel. Therefore, a first contact portion and a second contact portion of the first metal layer are electrically connected to the active layer, and a source electrode and a drain electrode of the second metal layer are electrically connected to the first/second contact portion respectively for the high-pixel-density display panel.