Organic Insulation Isolation Barrier with Embedded Capacitors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Propagating digital data across an intermediate isolation barrier between two domains with different ground potential references is challenging due to common mode voltage transients, and existing materials for isolation barriers often require trade-offs between electrical and mechanical characteristics, cost, and reliability under adverse conditions.
Innovation Solution
A digital signal isolator device using an isolation barrier with organic or semi-organic insulating materials and embedded parallel capacitor plates, supported by metal paddles, which provides improved electrical isolation and mechanical integrity while minimizing creepage effects through self-healing properties and reduced manufacturing operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional insulating materials are used for the isolation barrier, then electrical isolation is achieved, but mechanical characteristics and cost are compromised
Solution Approach 1:
The patent employs organic and semi-organic insulating materials (such as polyimide, Parylene, or epoxy-based compounds) that combine electrical isolation properties with improved mechanical characteristics. These composite materials provide both the required dielectric strength for electrical isolation and flexibility for standard fabrication processes, resolving the contradiction between electrical performance and manufacturability.
Solution Approach 2:
The patent modifies the material parameters by selecting organic/semi-organic compounds with specific dielectric constants, breakdown voltages, and mechanical properties. By adjusting material thickness, composition, and physical state, the patent achieves optimal balance between electrical isolation and mechanical workability without requiring complex fabrication processes.
2Ease of manufacture
If silicon-based substrates and standard IC packaging techniques are used, then manufacturing cost and existing practice are aligned, but creepage resistance is reduced
Solution Approach 1:
The patent uses thin-film organic and semi-organic insulating materials deposited or laminated onto the isolation barrier structure. These thin films provide effective electrical isolation and creepage resistance without requiring thick material layers, maintaining compact device dimensions while improving resistance to surface conduction paths. The flexible nature of these films allows conformal coverage of complex substrate surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively mitigates common mode voltage transients and enhances reliability by using cost-effective organic or semi-organic materials with self-healing properties, reducing creepage issues and improving manufacturing efficiency.
Implementation Method 1
an isolation barrier containing an organic and/or a semi-organic insulating material
Implementation Method 2
a capacitor comprising a pair of parallel capacitor plates embedded inside
Data Source
AI summary
Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.