Organic Interconnect Module for Shorter Wire Bonds in Die Stacks
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Solution Overview
Problem
The increasing height of stacked semiconductor dies poses challenges to electrical connections, leading to issues such as wire sweep, signal delay, and desynchronization, while using costly materials like gold does not completely alleviate these concerns.
Innovation Solution
Implementing an interconnect module made of organic materials, such as prepreg substrates, with conductive vias that elevate bond pads above the package substrate, allowing shorter wire bonds and reducing signal travel distance, thereby minimizing wire sweep and signal delay.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the height of die stacks is increased to increase capacity and performance, then the capacity and speed of semiconductor assemblies are improved, but wire sweep and signal delay worsen
Solution Approach 1:
The patent introduces an intermediate layer (organic substrate with conductive vias) that creates a new dimensional space for electrical connections. Instead of direct vertical wire bonds from the highest die to the substrate, the invention adds a horizontal intermediate plane at an intermediate height, allowing signals to travel through conductive vias embedded in the organic substrate. This dimensional change breaks the direct vertical path into segments, reducing wire sweep while maintaining electrical connectivity for high-capacity stacks.
Solution Approach 2:
The organic substrate with conductive vias serves as an intermediary element between the stacked dies and the final substrate. This mediator provides elevated bond pads that reduce wire bond length and signal travel distance. The intermediary structure includes conductive vias formed through the organic substrate material, creating controlled electrical pathways that minimize signal delay and wire sweep effects while supporting increased die stack heights.
2Reliability
If costly materials like gold are used for wire bonds, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The invention replaces expensive gold wire bonds with cheaper alternative materials for the intermediate connection structure. The organic substrate with conductive vias uses cost-effective materials such as copper or aluminum traces embedded in the organic substrate, eliminating the need for expensive gold plating or wire bonds in the intermediate connection stage. This approach maintains electrical reliability while significantly reducing material costs.
Solution Approach 2:
The invention changes the material parameters of the electrical connection system by transitioning from precious metal wire bonds to organic substrate-based conductive pathways. The conductive vias are formed using standard semiconductor materials and processes, changing the physical and chemical parameters of the connection medium to achieve cost reduction while maintaining acceptable electrical performance for the intermediate connection function.
3Adaptability or versatility
If longer wire bonds are used to connect higher dies, then all dies can be electrically connected, but signal delay and desynchronization increase
Solution Approach 1:
The patent segments the electrical connection path into multiple shorter stages. Instead of one long wire bond from the highest die to the substrate, the connection is divided into: (1) wire bonds from individual dies to the organic substrate, and (2) conductive via pathways through the organic substrate to the final substrate. This segmentation reduces the length of any single electrical pathway, minimizing signal delay and desynchronization while maintaining comprehensive electrical connectivity across all stacked dies.
Data Source
AI summary
Stacked semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device can include a package substrate and a stack of semiconductor dies carried by the package substrate. The stack of semiconductor dies includes a first die carried by the package substrate and a second die carried by the first die. The semiconductor device also includes an interconnect module carried by the package substrate adjacent the stack of semiconductor dies. The interconnect module includes a first end coupled the package substrate, a second end opposite the first end, a conductive via extending through a body of organic material from the first end to the second end. The first semiconductor die can is electrically coupled directly to the package substrate, while the second semiconductor die is electrically coupled to the package substrate through the second end of the interconnect module.