Organic Interposer Dicing With Blade Precutting Against Delamination
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Solution Overview
Problem
The formation of a recast layer during laser precutting in the dicing process of organic interposers leads to delamination issues between the organic material and the encapsulant, which can compromise the integrity of the packaging process.
Innovation Solution
The use of a blade for precutting instead of laser cutting to avoid the formation of a recast layer, ensuring direct contact between the organic dielectric material and the encapsulant, thereby reducing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser precutting is used to separate packages in reconstructed wafer, then cutting efficiency is improved, but recast layer forms causing delamination between organic material and encapsulant
Solution Approach 1:
The patent extracts and eliminates the harmful recast layer formed during laser precutting by introducing a mechanical scraping element (blade or scraper) that removes the recast layer during the precutting process, preventing delamination between the organic interposer and encapsulant
Solution Approach 2:
The patent introduces a mechanical blade or scraper as an intermediary element between the laser beam and the organic material surface. This intermediary mechanically removes the recast layer that would otherwise cause delamination, while allowing the laser to maintain its cutting function
2Reliability
If blade precutting is used instead of laser, then recast layer formation is avoided maintaining material integrity, but cutting speed and efficiency decrease
Solution Approach 1:
The patent merges laser precutting and mechanical scraping into a single integrated process. The laser provides rapid cutting while the mechanical blade simultaneously removes recast layer, combining the advantages of both methods (speed of laser, integrity of mechanical cutting) into one operation
Solution Approach 2:
The patent employs a composite cutting mechanism combining thermal energy (laser) and mechanical action (blade/scraper) in a coordinated manner. The laser softens or melts the material for easy cutting while the mechanical element prevents recast layer adhesion, creating a synergistic effect that overcomes the limitations of either method alone
Data Source
AI summary
A method includes forming an interconnect component including a plurality of dielectric layers that include an organic dielectric material, and a plurality of redistribution lines extending into the plurality of dielectric layers. The method further includes bonding a first package component and a second package component to the interconnect component, encapsulating the first package component and the second package component in an encapsulant, and precutting the interconnect component using a blade to form a trench. The trench penetrates through the interconnect component, and partially extends into the encapsulant. The method further includes performing a singulation process to separate the first package component and the second package component into a first package and a second package, respectively.