Organic Interposer With Inorganic Device Layers for Large-Area Packaging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Organic interposers are cost-effective but limited in integrating passive and active devices, while silicon interposers, though capable, are expensive and have poor power delivery due to through silicon vias, making them unsuitable for large-area systems like AI and HPC applications.

Innovation Solution

Hybrid interposers combining inorganic layers with integrated passive and/or active devices and organic layers for electrical routing, utilizing layer transfer processes to integrate semiconductor materials, providing cost-effective and high-performance interconnect solutions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If organic interposers are used, then cost is reduced, but the ability to integrate passive and active devices is lost

Engineering Contradiction:

ImprovecostVSAvoidability to integrate passive and active devices

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The interposer is divided into two distinct strata: a first strata comprising inorganic layers that integrate passive and/or active devices, and a second strata comprising organic dielectric layers that provide electrical routing. This segmentation allows each strata to fulfill its specialized function, resolving the contradiction between cost-effectiveness and device integration capability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The interposer uses a composite structure combining inorganic materials (for device integration) and organic materials (for routing and cost-effectiveness). This composite approach leverages the advantages of both material types, enabling both passive/active device integration and cost-effective manufacturing

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If silicon interposers are used, then passive and active devices can be integrated, but cost increases and power delivery performance deteriorates

Engineering Contradiction:

Improveability to integrate passive and active devicesVSAvoidcost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By separating the device integration function (inorganic strata) from the routing function (organic strata), the design eliminates the need for expensive through-silicon vias while maintaining device integration capability. The inorganic layers provide the necessary structural support and device integration, while organic layers provide cost-effective routing

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If silicon interposers are used, then passive and active devices can be integrated, but power delivery performance deteriorates

Engineering Contradiction:

Improveability to integrate passive and active devicesVSAvoidpower delivery performance

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The hybrid organic-inorganic composite structure enables improved power delivery by using the inorganic strata for device integration and the organic strata for electrical routing. This composite approach avoids the power delivery issues associated with through-silicon vias while maintaining device integration capabilities

Inventive Principle:

Principle #40Composite materials

Data Source

PatentEP4672334A1Organic interposer with inorganic layers containing passive and/or active devices

Publication Date: 2025.12.31 INTEL CORP

Figure 1~2A
Figure 2B~2C
Figure 3A~3C

AI summary

Embodiments disclosed herein include an apparatus with a first layer, where the first layer is a first inorganic material. The apparatus may also include a second layer over the first layer, where the second layer is a second inorganic material. In an embodiment, the second layer includes an active electrical device or a passive electrical device. In an embodiment, the apparatus further includes a third layer over the second layer, where the third layer is an organic buildup film. In an embodiment, the passive electrical device or the active electrical device is electrically coupled to one or more electrically conductive traces embedded in the third layer.