Organic Interposer Pad Structure for Fine-Pitch Stress Relief
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Solution Overview
Problem
Existing ASIC packages integrate CPU, GPU, memory, and input/output circuits into a large SoC, requiring different process technologies, leading to low yield and high cost due to size and feature size mismatches.
Innovation Solution
A package structure comprising a package substrate, an organic interposer, and an electronic unit, where the organic interposer is directly connected to the package substrate using pads and nanowire contact portions, allowing for stress-free bonding and reduced pitch between pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If CPU, GPU, memory and input/output circuit are integrated into a large SoC, then functionality is improved, but manufacturing precision and yield deteriorate due to feature size mismatches
Solution Approach 1:
The patent divides the SoC into separate functional modules (CPU, GPU, memory, input/output circuit) that can be manufactured independently on different process nodes and then interconnected through the organic interposer. This segmentation allows each module to be optimized for its specific process requirements while maintaining overall system functionality.
Solution Approach 2:
The organic interposer serves as an intermediary substrate that interfaces between the separately manufactured functional modules. It provides the interconnection infrastructure that allows modules made with different process technologies to work together, resolving the feature size mismatch problem while maintaining system integration.
2Ease of manufacture
If different process technologies are used for CPU, GPU, memory and input/output circuit, then manufacturing flexibility is improved, but device complexity increases
Solution Approach 1:
The organic interposer is designed as a universal platform that can interface with multiple types of functional modules (CPU, GPU, memory, input/output circuit) regardless of their specific process nodes. This multi-functional interposer simplifies the integration process by providing a standardized interface for diverse components.
3Area of stationary object
If pads are directly connected without solder balls, then pitch between pads is reduced, but bonding stress increases
Solution Approach 1:
The patent employs an organic interposer with a flexible organic substrate that can accommodate the direct pad-to-pad connection geometry. The organic material provides stress relief and flexibility that compensates for the increased bonding stress, enabling smaller pitch connections without compromising bond strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a smaller SoC volume, higher yield, and lower production cost while maintaining high structural reliability and reducing parasitic capacitance.
Implementation Method 1
A first extension direction of the pad portion is different from a second extension direction of the contact portions. The electronic unit is disposed on the organic interposer, wherein the electronic unit is electrically connected to the package substrate through the organic interposer.
Implementation Method 2
a method of connecting the second pads to the first pads comprises sintering the second pads to the first pads at bonding temperature of 170° C.
Implementation Method 3
or welding the plurality of the second pads to the plurality of the first pads at room temperature
Data Source
AI summary
A package structure includes a package substrate, an organic interposer and an electronic unit. The package substrate includes a plurality of first pads. The organic interposer is disposed on the package substrate and includes a plurality of second pads. The second pads are directly connected to the first pads to electrically connected the organic interposer to the package substrate. At least one of each of the first pads and each of the second pads includes a pad portion and a plurality of contact portions connecting the pad portion. A first extension direction of the pad portion is different from a second extension direction of the contact portions. The electronic unit is disposed on the organic interposer, wherein the electronic unit is electrically connected to the package substrate through the organic interposer.