Organic Interposer Spacing for PCB Alignment and Flatness
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Solution Overview
Problem
Existing techniques for increasing the number of CPU and GPU cores in server products and integrating high bandwidth memory (HBM) face challenges such as alignment issues, high costs, and complex assembly processes, particularly with silicon bridges and silicon interposers.
Innovation Solution
A printed circuit board (PCB) is manufactured with a substrate structure and an interconnect structure, featuring separate connection regions that are spaced apart and not connected, to address alignment issues and improve flatness, thereby enhancing packaging yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If silicon bridges are embedded to connect multiple dies, then the number of cores can be increased, but alignment issues occur and undulation appears on the substrate surface
Solution Approach 1:
The patent introduces an organic interposer as an intermediary component between multiple semiconductor dies. This interposer includes a flat substrate with connection regions that facilitate precise alignment and electrical connection between dies, eliminating the alignment issues and surface undulation problems associated with direct silicon bridge embedding.
2Manufacturing precision
If silicon interposers are used to connect dies with fine circuit line width, then high bandwidth memory integration is achieved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent changes the material parameter from silicon to organic materials for the interposer substrate. This parameter change enables the use of standard PCB manufacturing processes instead of complex silicon fabrication processes, thereby reducing manufacturing complexity while maintaining the capability to support fine circuit line widths and high bandwidth memory integration.
3Quantity of substance
If silicon interposers are used for die-to-die connection, then high bandwidth memory integration is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive silicon interposers with cost-effective organic interposer materials that can be manufactured using standard PCB processes. This substitution significantly reduces manufacturing costs while maintaining the functional capability to integrate high bandwidth memory through die-to-die connections.
Data Source
AI summary
A printed circuit board includes a substrate structure including a first insulating material, a plurality of first wiring layers disposed on or in the first insulating material, and a plurality of first via layers disposed in the first insulating material; and an interconnect structure including a second insulating material, a plurality of second wiring layers disposed on or in the second insulating material, and one or more second via layers disposed in the second insulating material. The interconnect structure is disposed on an upper side of the substrate structure. The interconnect structure includes first and second connection regions. The first and second connection regions are spaced apart from each other.