Organic Insulating Laminate Bonding with Polished Composite Layers

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Solution Overview

Problem

The direct bonding technique using inorganic insulating materials for semiconductor devices is prone to defects due to cutting debris and surface irregularities, and requires expensive processing steps, while organic insulating materials have lower bonding strength, increasing manufacturing costs.

Innovation Solution

A method involving the formation and polishing of organic insulating layers with thermosetting resins and inorganic oxide particles to enhance bonding strength while reducing costs, where the organic insulating layers are polished to achieve a surface roughness of 50 nm or less and inorganic oxide particles are used in a volume range of 15% to 70% to ensure accurate bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If inorganic insulating material is used for direct bonding, then bonding strength is improved, but manufacturing cost increases and defects occur due to cutting debris

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent uses composite organic insulating layers containing both organic resin and inorganic oxide particles. This composite structure combines the bonding strength of inorganic materials with the cost-effectiveness and debris-embedding capability of organic materials, resolving the contradiction between bonding strength and manufacturing cost

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the physical and chemical parameters of the organic insulating material by adding inorganic oxide particles with specific volume fractions (15-70%). This parameter modification enhances the bonding strength of organic materials to approach inorganic material levels while maintaining the advantages of organic materials

Inventive Principle:

Principle #35Parameter changes

2Strength

If inorganic insulating material is used for direct bonding, then bonding strength is improved, but bonding defects occur due to cutting debris and surface irregularities

Engineering Contradiction:

Improvebonding strengthVSAvoidbonding quality

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent converts the harmful effect of cutting debris into a beneficial one by using the softer organic resin material to embed and trap the debris during bonding. The inorganic oxide particles within the organic matrix further enhance bonding strength while the organic material's compliance allows it to absorb surface irregularities, transforming potential defects into a reliable bonding process

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If organic insulating material is used, then manufacturing cost is reduced and debris embedding is improved, but bonding strength decreases

Engineering Contradiction:

Improvemanufacturing costVSAvoidbonding strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent creates a composite organic insulating layer by dispersing inorganic oxide particles within the organic resin matrix. This composite structure maintains the cost-effectiveness and debris-embedding properties of organic materials while the inorganic particles provide enhanced bonding strength, thus resolving the contradiction between manufacturing cost and bonding strength

Inventive Principle:

Principle #40Composite materials

4Strength

If inorganic oxide particles are added to organic insulating layer, then bonding strength is improved, but surface roughness increases

Engineering Contradiction:

Improvebonding strengthVSAvoidsurface roughness

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent carefully controls the parameters of the inorganic oxide particles, including their volume fraction (15-70%), size distribution, and surface treatment, to optimize the balance between bonding strength and surface roughness. By adjusting these parameters, the patent achieves sufficient bonding strength while maintaining acceptable surface quality for bonding applications

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method increases the bonding strength between organic insulating layers while reducing manufacturing costs by ensuring accurate bonding and protecting semiconductor chips and wiring electrodes within the organic insulating material.

Implementation Method 1

the thermosetting resins contained in the first and second organic insulating layers are bonded to each other

Methodology Applied

Scientific EffectChemical bonding: Chemical Bonding

Implementation Method 2

the inorganic oxide particles contained in the first and second organic insulating layers are joined to each other

Methodology Applied

Scientific EffectVan der Waals force: Van der Waals Force

Implementation Method 3

polishing a first surface of the first organic insulating layer to planarize the first surface

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS20250105205A1Laminate manufacturing method and laminate

Publication Date: 2025.03.27 RESONAC CORP

AI summary

A method for manufacturing a laminate includes forming a first organic insulating layer including a first thermosetting resin and first inorganic oxide particles on a first support substrate, polishing a first surface of the first organic insulating layer to planarize the first surface, and bonding the polished first surface to a second surface of a second organic insulating layer including a second thermosetting resin and second inorganic oxide particles.