Organic Material Layer for Void-Free Color Filter Adhesion
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Solution Overview
Problem
Solid-state imaging elements with colored layers embedded between partition walls are prone to void generation when exposed to high humidity, leading to reduced sensitivity, especially when using epoxy resin or 1,1,1,3,3,3-hexamethyldisilazane adhesive layers.
Innovation Solution
Incorporating organic material layers formed with a compound having an ethylenically unsaturated bond between partition walls and colored layers, with a thickness of 30 nm or less, and using a resin with an acid value of 10 to 100 mgKOH/g and a weight-average molecular weight of 5,000 to 20,000, which includes a surfactant and is used to form colored layers with a compound having an ethylenically unsaturated bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive layers are formed using epoxy resin or 1,1,1,3,3,3-hexamethyldisilazane between partition walls and colored layers, then adhesion is provided, but voids are easily generated between the colored layers and partition walls when exposed to high humidity
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by using compounds with ethylenically unsaturated bonds instead of conventional epoxy resin or hexamethyldisilazane. This parameter change in material composition provides both adhesion and resistance to void generation in high humidity environments.
Solution Approach 2:
The patent employs composite material strategy by combining compounds with ethylenically unsaturated bonds (such as vinyl groups, allyl groups, or acryloyl groups) with appropriate molecular weights and acid values. This composite approach creates an adhesive layer that simultaneously achieves bonding strength and moisture resistance.
2Reliability
If organic material layers are formed to prevent void generation, then moisture resistance is improved, but device complexity increases
Solution Approach 1:
The adhesive layer serves multiple functions simultaneously: it provides adhesion between partition walls and colored layers, acts as a moisture barrier to prevent void generation, and maintains structural integrity. This multi-functionality reduces the need for additional separate layers, thereby limiting complexity increase.
Solution Approach 2:
The organic material layer with ethylenically unsaturated bonds acts as an intermediary between the partition walls and colored layers, mediating both mechanical adhesion and chemical resistance to moisture. This single intermediary layer replaces what would otherwise require multiple separate functional layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces void generation between colored layers and partition walls, enhancing moisture resistance and adhesiveness, thereby maintaining sensitivity even in humid environments.
Implementation Method 1
organic material layers formed using a composition including a compound having a group with an ethylenically unsaturated bond between the partition walls and the colored layers
Data Source
AI summary
Provided are a structure having excellent moisture resistance, a color filter, a solid-state imaging element, an image display device, and a method for producing a structure. Provided is also a composition for forming an organic material layer which is used to form the above-mentioned structure. This structure 100 has a support 1, partition walls 2 formed on the support 1, colored layers 4 formed in regions partitioned by the partition walls 2, on the support 1, and organic material layers 3 formed using a composition including a compound having a group with an ethylenically unsaturated bond, between the partition walls 2 and the colored layers 4.