Organic Electronic Device Layer Thickness Control
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Solution Overview
Problem
The challenge in manufacturing organic electronic devices is achieving desired performance when a layer formed using a solvent with a boiling point of 160° C or more, as the solvent permeates into previous layers, causing thickness deviations and affecting the performance of subsequent layers.
Innovation Solution
A method is developed where the first layer is formed with a thickness smaller than the desired value to account for the increase caused by the second layer, using a solvent with a boiling point of 160° C or more, ensuring the first layer maintains the desired thickness even after the second layer is formed, and optimizing the thickness through prototype layers and calculation steps to achieve the desired performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a coating solution containing a solvent with boiling point of 160°C or more is used to form the second layer, then the second layer can be formed successfully, but the solvent permeates into the first layer causing its thickness to deviate from the design value
Solution Approach 1:
The first layer is formed with a thickness smaller than the design value in advance, anticipating the thickness increase that will occur when the second layer is formed. This preliminary adjustment ensures that after solvent permeation and second layer formation, the first layer reaches the desired design thickness.
Solution Approach 2:
The invention applies a counteracting measure by intentionally forming the first layer thinner than required, which compensates for the harmful effect of solvent permeation that would otherwise cause excessive thickness. This preliminary anti-action offsets the anticipated thickness deviation.
2Manufacturing precision
If the first layer is formed with the desired thickness initially, then the first layer meets design specifications, but the thickness increases when the second layer is formed using high boiling point solvent
Solution Approach 1:
The first layer thickness is preliminarily adjusted to be smaller than the design value before forming the second layer. This preliminary action accounts for the anticipated thickness increase due to solvent permeation, ensuring final thickness stability at the design value.
Solution Approach 2:
The invention changes the thickness parameter of the first layer from the design value to a smaller value, specifically tailored to compensate for the expected thickness increase. This parameter adjustment maintains thickness stability throughout the manufacturing process.
3Ease of operation
If a solvent with boiling point of 160°C or more is used, then the coating solution has longer drying time allowing better processing, but the solvent stays on the first layer longer causing greater thickness deviation
Solution Approach 1:
The first layer is formed with reduced thickness in advance to compensate for the prolonged solvent residence time. This preliminary adjustment ensures that even with extended drying time allowing better processing, the final thickness remains at the design value.
Solution Approach 2:
The thickness parameter of the first layer is specifically adjusted downward to account for the longer solvent residence time associated with high boiling point solvents. This parameter change balances the extended processing time with maintained manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of organic electronic devices that achieve the desired performance by maintaining the first layer's thickness, thereby ensuring the organic electronic device's functionality and efficiency, particularly in light-emitting efficiency.
Implementation Method 1
the solvent permeates into a layer formed previously (hereinafter, referred to as a 'first layer') and a thickness of the first layer deviates from a design value
Data Source
AI summary
According to an embodiment, a method of manufacturing an organic electronic device including a stack including a first electrode layer, one or more functional layers, and a second electrode layer, the one or more functional layers and the second electrode layer being formed in this order on the first electrode layer, comprises: a first layer forming step of forming a first layer 24 among the layers included in the stack; and a second layer forming step of forming a second layer on the first layer by using a coating solution containing a material for the second layer and a solvent with boiling point of 160° C. or more, the second layer being in contact with the first layer. In the first layer forming step, the first layer is formed with a thickness t smaller than a desired thickness such that the first layer has the desired thickness T due to an increase in a thickness of the first layer as the second layer is formed.