Organic Optoelectronic Component Integrated Adhesive Layer Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing organic optoelectronic components require separate adhesive layers for bonding, which increases costs and complexity, especially when integrating with glass components, where clamping can be difficult and unreliable.
Innovation Solution
An organic optoelectronic component with an integrated adhesive layer structure, comprising a cured first adhesive layer and an adherent, elastic second adhesive layer, along with a protective film that can be partially separated for easy application, eliminating the need for additional adhesives and simplifying the installation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate adhesive layers are used for bonding organic optoelectronic components, then bonding reliability is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines multiple adhesive layers with different functions into a single integrated adhesive layer structure. The first adhesive layer provides bonding function while the second adhesive layer provides sealing function, both within one continuous layer without interfaces, thereby reducing device complexity while maintaining bonding reliability.
Solution Approach 2:
The integrated adhesive layer structure performs multiple functions simultaneously: the first adhesive layer provides bonding between components, while the second adhesive layer provides sealing protection. This multi-functional design eliminates the need for separate adhesive and sealing components, reducing overall device complexity.
2Strength
If separate adhesive layers are used for bonding, then bonding strength is improved, but manufacturing cost increases
Solution Approach 1:
By merging the bonding function (first adhesive layer) and sealing function (second adhesive layer) into a single integrated adhesive layer structure, the patent reduces the total number of components and assembly steps, thereby lowering manufacturing cost while maintaining bonding strength.
Solution Approach 2:
The adhesive layer structure is pre-configured during manufacturing with the first adhesive layer already in place for bonding, and the second adhesive layer prepared for sealing. This preliminary arrangement eliminates the need for customers to apply additional adhesives, reducing overall manufacturing cost.
3Ease of operation
If adhesive bonding is used for integration, then ease of assembly is improved, but additional adhesive costs and coordination requirements increase
Solution Approach 1:
The organic optoelectronic component includes an integrated adhesive layer structure that provides both bonding and sealing functions self-sufficiently. The first adhesive layer enables easy assembly through bonding, while the second adhesive layer simultaneously provides sealing, eliminating the need for customers to coordinate additional adhesive applications or sealing measures.
4Ease of manufacture
If clamping is used instead of adhesive bonding, then adhesive costs are reduced, but reliability with glass components deteriorates
Solution Approach 1:
The patent merges the bonding function and sealing function into one integrated adhesive layer structure, allowing adhesive bonding to achieve both connection and protection simultaneously. This eliminates the need for clamping mechanisms, maintaining connection reliability with glass components while avoiding the complexity and unreliability of mechanical fastening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces costs by eliminating the need for separate adhesives, simplifies the installation process, and ensures a predefined adhesive interface, enhancing the reliability and ease of fitting the component in desired applications.
Implementation Method 1
The first adhesive layer (3a) is cured
Implementation Method 2
the second adhesive layer (3b) is adherent and elastic
Data Source
AI summary
In various aspects, an organic optoelectronic component and method for producing an organic optoelectronic component are described. An organic optoelectronic component may include a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, an adhesive layer structure, and a protective film. The adhesive layer structure may contain a first adhesive layer above the first adhesive layer, and a second adhesive layer above the first adhesive layer. The first adhesive layer may be cured. The second adhesive layer may be adherent and elastic. The protective film may be above the second adhesive layer. The protective film may contain at least one region that is at least partly separated in a lateral direction.