Organic Semiconductor Composition with Low Water Solvent
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Solution Overview
Problem
Existing compositions for manufacturing organic semiconductor devices exhibit variability in carrier mobility, with some providing high mobility while others offer low mobility despite using the same solvent, necessitating a solution for stable high carrier mobility.
Innovation Solution
A composition comprising 2,3-dihydrobenzofuran as a solvent with a water content of 0.25 wt% or less, combined with specific organic semiconductor materials, specifically compounds represented by formulas (1-1) to (1-10), to achieve high carrier mobility in organic semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same solvent is used for dissolving organic semiconductor material, then the manufacturing process is simplified, but carrier mobility varies between high and low values without stable control
Solution Approach 1:
The invention changes the water content parameter of the solvent from conventional levels to specifically 0.25 wt% or less. This parameter change transforms the solvent system to enable stable high carrier mobility while maintaining the simplicity of using a single solvent type for dissolving the organic semiconductor material.
Solution Approach 2:
The invention establishes a feedback mechanism where the water content of the solvent is precisely controlled and monitored. By setting the water content at 0.25 wt% or less, the system feedbacks to ensure consistent carrier mobility performance across different manufacturing batches, eliminating the variability observed with conventional solvents.
2Reliability
If inorganic semiconductor materials are used for manufacturing transistors, then transistor performance is achieved, but manufacturing temperature is high and equipment cost is expensive
Solution Approach 1:
The invention employs organic semiconductor materials that can be processed at lower temperatures compared to inorganic materials. The use of soluble organic compounds allows for low-temperature manufacturing processes, replacing expensive inorganic semiconductor materials and high-temperature equipment with more accessible organic alternatives.
Solution Approach 2:
The invention changes the material composition parameter from inorganic to organic semiconductor materials. This fundamental parameter change enables the manufacturing process temperature to be reduced from high temperatures required for inorganic materials to lower temperatures suitable for organic material processing.
3Temperature
If glass substrates are used for transistor manufacturing, then heat resistance is high, but impact resistance is low and flexibility is poor
Solution Approach 1:
The invention changes the substrate material parameter from glass to plastic substrates. This parameter change is enabled by the low processing temperature of organic semiconductor materials, allowing the use of plastic substrates that offer superior impact resistance and flexibility while maintaining compatibility with the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition stably achieves high carrier mobility in organic semiconductor devices, enhancing transistor properties and enabling the formation of lightweight, flexible, and cost-effective electronic devices.
Implementation Method 1
a composition for manufacturing an organic semiconductor device, containing 2,3-dihydrobenzofuran as a solvent and an organic semiconductor material
Data Source
AI summary
Provided is a composition for manufacturing an organic semiconductor device, the composition enabling formation of an organic semiconductor device that stably shows high carrier mobility. A composition for manufacturing an organic semiconductor device contains 2,3-dihydrobenzofuran as a solvent and an organic semiconductor material below, in which the water content of the solvent is 0.25 wt% or less. The organic semiconductor material: at least one compound selected from the group consisting of a compound represented by formula (1-1), a compound represented by formula (1-2), a compound represented by formula (1-3), a compound represented by formula (1-4), a compound represented by formula (1-5), and a compound represented by formula (1-6). wherein X1 and X2 are the same or different and each represent an oxygen atom, a sulfur atom, or a selenium atom, m is 0 or 1, n1 and n2 are the same or different and each represent 0 or 1, and R1 and R2 are the same or different and each represent a fluorine atom, a C1-20 alkyl group, a C6-13 aryl group, a pyridyl group, a furyl group, a thienyl group, or a thiazolyl group, in which 1 or 2 or more hydrogen atoms contained in the alkyl group may be substituted by a fluorine atom, and in which 1 or 2 or more hydrogen atoms contained in the aryl group, the pyridyl group, the furyl group, the thienyl group, and the thiazolyl group may be substituted by a fluorine atom or an alkyl group having 1 to 10 carbon atoms.)